| Allicdata Part #: | ATS-21F-64-C1-R0-ND |
| Manufacturer Part#: |
ATS-21F-64-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-64-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-21F-64-C1-R0 application field and working principle
Heat sinks are an important thermal management device used in many products ranging from consumer electronics to industrial and medical devices. Heat sinks can have a variety of shapes and sizes including flat, curved, or angled. ATS-21F-64-C1-R0 heat sinks are thermal management devices commonly used in consumer electronics, computers, and other electrical and electronic components. The ATS-21F-64-C1-R0 heat sink features a low profile design which minimizes the risk of accidental damage, as well as an innovative cooling technology, allowing it to deliver efficient cooling performance.
The ATS-21F-64-C1-R0 is an extruded aluminum heat sink which is designed to be used with an external fan. The extruded fins of this heat sink are designed as a dual-channel shape, providing some additional air flow resistance which aids in cooling. The extrusion on the top part of the heat sink provides additional surface area for heat dissipation, as well as allowing the fan to draw air from both sides of the sink for more efficient cooling.
The ATS-21F-64-C1-R0 heat sink features copper heat pipes which are integrated into the base and dissipate heat away from the processor. The copper heat pipes conduct heat away from the processor and into the surrounding fins which further heat dissipation. The fins transfer the heat to the surrounding environment through convection. The greater surface area of the fins increases the surface area of the heat sink available for transfer of heat which in turn helps to ensure optimal cooling performance and maximum possible heat dissipation.
Due to the innovative design of the ATS-21F-64-C1-R0 heat sink, it is capable of delivering excellent thermal performance. This is due to the combination of the copper heat pipes and the efficient air flow design. The copper heat pipes efficiently and quickly transfer heat away from the processor, while the dual-channel design of the extruded fins provides additional air flow resistance which aids in cooling.
The ATS-21F-64-C1-R0 is an excellent choice for many electronics and computer applications which require efficient thermal management. It is lightweight and easy to install and requires minimal maintenance. In addition to its excellent cooling performance, the ATS-21F-64-C1-R0 is also designed to be long lasting and reliable, making it a great choice for many applications.
The specific data is subject to PDF, and the above content is for reference