| Allicdata Part #: | ATS35488-ND |
| Manufacturer Part#: |
ATS-21F-79-C2-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-79-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.32010 |
| 10 +: | $ 3.23379 |
| 25 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in today’s electronic devices and equipment production. Heat sinks play an essential role in the successful operation of electronic components and equipment. Heat sinks are used to absorb and dissipate thermal energy from electronic components to the ambient air. They are designed to reduce the temperature to acceptable levels, allowing high-performance components and systems to function as intended.
The ATS-21F-79-C2-R0 is a state of the art heat sink from ATS Thermal. It is a two-piece extruded aluminum heat sink designed for applications up to 150°C/302°F. It has a high thermal conductivity to ensure efficient heat transfer from device to ambient air. The front of the device is composed of aluminum ribs, and the back has aluminum fins to increase surface area for heat dissipation. This allows for efficient heat transfer across the entire surface area and provides maximum cooling.
The ATS-21F-79-C2-R0 is an ideal heat sink for applications such as power supplies, LED lighting, transmitter and receivers,rf amplifiers, processors, microcontrollers and other high-performance components requiring additional cooling. This heat sink also offers excellent corrosion resistance and is designed to match the highest quality standards for performance and reliability.
The working principle of the ATS-21F-79-C2-R0 is quite simple. Heat is generated by the electronic component as it operates and is absorbed by the heat sink. As this heat is transferred to the ambient air, cooling is achieved. The device’s unique two-piece design allows for increased surface area for improved heat transfer. As the heat is transferred to the surface of the fins, convection currents from the air naturally take it away from the component, achieving maximum cooling.
The ATS-21F-79-C2-R0 is an ideal solution for any thermal management application requiring efficient heat dissipation. It is a highly efficient, compact and durable heat sink designed to meet the needs of high-performance components and devices. The two-piece design ensures improved and reliable heat transfer and its high corrosion resistance makes it a perfect choice for many applications. This heat sink offers optimal performance and reliability, making it an excellent choice for any thermal management application.
The specific data is subject to PDF, and the above content is for reference