| Allicdata Part #: | ATS-21F-80-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-80-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-80-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-21F-80-C3-R0 is a thermal heat sink, which is widely used to dissipate heat efficiently from electrical and electronic components. It is a lightweight and cost-effective solution, suitable for many applications requiring high-performance cooling.
The basic feature of a thermal heat sink is that it is a passive device that dissipates heat away from the hot component, decreasing the system\'s overall temperature. The ATS-21F-80-C3-R0 is composed of a metal heat transfer plate and aluminum fins that absorb and dissipate heat while providing a high thermal conductivity.
The ATS-21F-80-C3-R0 has a unique base design that facilitates thermal conduction to dissipate heat quickly from the component at a high temperature. The metal core has an area of about 80 cm2 and a thickness of 0.3mm. It includes an integrated mounting bracket to attach the heat sink to the device, which facilitates efficient heat dissipation. The heat sink has a light weight and power rating of up to 10 Watts, which makes it suitable for many applications.
The ATS-21F-80-C3-R0 is a reliable thermal heat sink, designed to dissipate heat efficiently. Its enclosed design, low power rating, and attractive anodized finish make it suitable for applications in a range of industries.
The working principle of an ATS-21F-80-C3-R0 thermal heat sink is based on the natural phenomenon of convection, where warm air rises and cold air sinks. This means that the heat generated by the component will be dissipated away from it through rising warm air, and replaced by the cold air around the heat sink. This process is known as thermal convection, and is the key to the ATS-21F-80-C3-R0\'s efficient heat dissipation.
The ATS-21F-80-C3-R0 is widely used in many applications, including power supplies, home appliances, audio/visual systems, and telecommunications. Its reliable cooling performance makes it suitable for use in high-temperature applications, including automotive and aerospace components. It is also well-suited for thermal management of electrical components, such as LEDs, resistors, and capacitors. The heat sink\'s design allows it to be fitted to components with different dimensions, enabling it to be used with different types of electronic equipment.
Overall, the ATS-21F-80-C3-R0 is an efficient and reliable thermal heat sink that dissipates heat quickly at high temperatures. Its features make it suitable for a range of applications, including automotive and aerospace components. Its lightweight design and attractive anodized finish make it an attractive solution for many thermal management applications.
The specific data is subject to PDF, and the above content is for reference