| Allicdata Part #: | ATS-21F-82-C3-R0-ND |
| Manufacturer Part#: |
ATS-21F-82-C3-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-82-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is integral to the proper functioning of any electronic device or system. Thermal energy is the energy generated by the device/system and needs to be dissipated away from the component and dissipated away from the device/system. Thermal-heat sinks are devices used to dissipate heat away from the component or system. The ATS-21F-82-C3-R0 thermal-heat sink is designed to efficiently and effectively dissipate heat from electronic components.
The ATS-21F-82-C3-R0 is a metal alloy, silver plated aluminum heat sink with bent fins for enhanced heat dissipation. This design provides a compact and cost-effective solution for the cooling of processors, CPUs, and other integrated circuits. The aluminum alloy metal allows for more efficient transfer of heat than copper based heat sinks with similar dimensions, as the ATS-21F-82-C3-R0 is much lighter. It is also corrosion resistant and has excellent electrical conductivity.
The fins are curved along the outer edges and bent at a specific angle to maximize the ground surface contact with the air flow when the unit is installed. This increases the heat dissipation ability of the sink, as more air can quickly pass over the fins and absorb the heat from the components. The bent design also gives the thermal-heat sink a low profile with a shorter overall length, thus allowing for easy installation into tight spaces.
In addition, the ATS-21F-82-C3-R0 comes with several mounting holes that slot into compatible mounting boards. This ensures that the heat sink is securely fastened in place without any movement. The mounting board also acts as a heat spreader, spreading the heat throughout the body of the sink exponentially. This further enhances the heat dissipation capabilities of the ATS-21F-82-C3-R0 thermal-heat sink.
The ATS-21F-82-C3-R0 is designed to be used in place of other standard copper-based heat sinks in applications up to 250 degrees Celsius. Additionally, it can handle voltages up to 15A. In summary, the ATS-21F-82-C3-R0 offers a durable, light-weight, cost-effective, and highly efficient solution for thermal management, making it ideal for use in data centers, automotive electronics, and medical devices.
The specific data is subject to PDF, and the above content is for reference