| Allicdata Part #: | ATS-21F-83-C1-R0-ND |
| Manufacturer Part#: |
ATS-21F-83-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-83-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are commonly used to dissipate large amounts of heat generated within electronic systems. Many different types of Heat Sinks are available, but the ATS-21F-83-C1-R0 model in particular is useful when attempting to precisely manage heat distribution within a system. In this article, the application field and working principle of the ATS-21F-83-C1-R0 Thermal - Heat sink will be explained.
Application Field
The ATS-21F-83-C1-R0 Thermal - Heat Sink can be used in a wide variety of applications, including:
- Data Centers
- High-Performance Computing (HPC) systems
- Server Farms
- Data Storage Systems
- Industrial Automation Equipment
- Telecommunications Equipment
- Video game consoles
- LEDs and other lighting systems
The ATS-21F-83-C1-R0 Thermal - Heat Sink is designed for use in high-powered applications where thermal management is essential for system stability and performance. The Heat Sink is able to dissipate upwards of 270 Watts of thermal energy in small form factor applications, making it ideal for a wide variety of high-performance applications.
Working Principle
The ATS-21F-83-C1-R0 Thermal - Heat Sink works on the principle of heat transfer. Heat transfer is the process of moving heat from one point to another. Heat is generated from the electronics within the system, and the heat must be dissipated in order to prevent damage to the electronics. The Heat Sink uses a combination of conduction and convection to transfer heat from the source to the surrounding environment.
The Heat Sink is composed of multiple layers of aluminum fins which are designed to promote efficient heat dissipation. The fins are arranged in a way that facilitates the exchange of heat between the source and the surrounding environment. The aluminum fins act as a conductor and transfer the heat from the source to the environment, where it is then dissipated by convection.
The ATS-21F-83-C1-R0 Thermal - Heat Sink also features a thermal interface between the Heat Sink and the source in order to provide an efficient path for heat to transfer from the source to the Heat Sink. This thermal interface helps to further increase the efficiency of heat dissipation by providing a direct contact between the source and the Heat Sink.
The ATS-21F-83-C1-R0 Thermal - Heat Sink is designed specifically for high-performance applications where thermal management is essential. The Heat Sink\'s efficient heat transfer design makes it an ideal choice for applications where a small form factor is required and where precise thermal management is needed.
The specific data is subject to PDF, and the above content is for reference