ATS-21F-92-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	16.45°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-21F-92-C1-R0 is a type of heat sink, which is used for cooling electronic components that generate large amounts of heat. It belongs to the thermal - heat sinks category, and is often used in applications that require high efficiency cooling, such as telecommunications systems, automotive and aerospace applications.

Application Fields and Working Principles

Heat sinks are typically used for passive cooling of electronic and other related components. Heat sinks employ conduction as the primary method of heat transfer, and they are designed to absorb and dissipate heat from a component or system. The ATS-21F-92-C1-R0 heat sink uses its patented FINSPIRE design, featuring a unique pattern of fins that are able to extract heat from components effectively. The fins are constructed from high-grade aluminum and feature a efficient thermal transfer coefficient.The ATS-21F-92-C1-R0 was developed with a wide range applications in mind, and can be used in both air-cooled and liquid-cooled systems. It is extremely efficient and is suitable for high power applications such as computers, automotive systems, telecoms, and other industrial applications. The heat sink can be customized to suit a variety of applications, with various sizes and styles available.The ATS-21F-92-C1-R0 heat sink is capable of high performance cooling due to its unique design, featuring multiple row of raised fins which help to disperse heat quickly and efficiently. The fins are designed to increase the surface area of the heat sink, thereby resulting in improved heat dissipation. The device also features an integrated heat spreader, which further helps improve heat transfer performance.In addition, the ATS-21F-92-C1-R0 features a specially designed baseplate, which helps to ensure a good heat exchange between the components and the heat sink. The baseplate is composed of lightweight aluminum, which is more efficient at dissipating heat than copper or other materials. This feature helps to ensure that the heat sink remains low in weight, making it ideal for use in applications where weight saving is of utmost importance.

Conclusion

The ATS-21F-92-C1-R0 heat sink is designed for a wide range of applications, and is an extremely efficient and effective cooling solution. The device features a patented fin design and a unique baseplate material, which helps to ensure better heat transfer and dissipation. The wide range of configurations and sizes available make the ATS-21F-92-C1-R0 an ideal choice for a variety of heat sink applications.

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