ATS-21G-10-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.87°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-Heat Sinks are devices designed to manage the dissipation of heat from electronic components and industrial and consumer appliances. ATS-21G-10-C1-R0 is one of the most popular Thermal-Heat Sinks available today, boasting a wide array of features and applications. This article provides a comprehensive overview of the ATS-21G-10-C1-R0, including its application field and working principle.

Application Field

The ATS-21G-10-C1-R0 is a versatile thermal-heat sink, suitable for a wide range of applications and devices. It can be used in it’s most common application, which is for heat dissipation of CPUs, GPUs and HDD. Other applications include, but are not limited to, the cooling of such components as power amplifiers, voltage regulators, power converters, embedded systems, laptop computers, as well as various types of consumer and industrial electronics. The device also has applications in advanced graphics processing and 3D printing. The ATS-21G-10-C1-R0 is well suited for applications which require efficient and effective heat dissipation, such as in many industrial and manufacturing processes. The device can also be used to reduce operating temperature in areas with low ambient temperatures, and is often deployed in cooling arrangements which can be used in conjunction with devices and components from other manufacturers. This makes the ATS-21G-10-C1-R0 a highly versatile Thermal-Heat Sink with a wide range of applications.

Working Principle

The ATS-21G-10-C1-R0 works on the principles of convection, radiation, and conduction. Heat from the device is moved away from the device through a combination of these three principles. Convection takes place when heated air moves away from the device due to its buoyancy in the atmosphere. This helps move hot air away from the device and cooler air in. Heat sinks also use radiation, which occurs when the device emits infrared radiation that draws in cooler air, thereby dissipating heat from the device. Lastly, conduction occurs when direct contact is made between the device and the thermal-heat sink, which helps to transfer heat away from the device and dissipate it into the atmosphere.

Conclusion

The ATS-21G-10-C1-R0 is a popular Thermal-Heat Sink device with a range of applications. It is particularly well-suited for cooling CPUs, GPUs and HDDs, as well as for use in industrial and manufacturing processes and in low ambient temperature locations. The device works using the principles of convection, radiation and conduction to effectively move heat away from the device. With its versatility and range of applications, the ATS-21G-10-C1-R0 is a reliable and dependable Thermal-Heat Sink.

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