| Allicdata Part #: | ATS-21G-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-21G-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21G-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.Thermal management is a critical concern when it comes to electronics. Heat sinks are an important part of the cooling system, as they conduct the heat from the electronics away from the device and into the surrounding environment. The ATS-21G-116-C3-R0 is a heat sink device that provides reliability and superior thermal management for numerous electronic products.
The ATS-21G-116-C3-R0 heat sink is specifically designed to dissipate the heat of high power electronic devices. It features a design that combines metal alloys and unique air flow patterns to increase the dissipation rate. The device is made up of a single piece aluminum body with a surface area of 116 square inches, making it ideal for high power applications.
The ATS-21G-116-C3-R0 is great for applications where space is limited, such as notebook computers, cell phones, and other small electronics. It’s flexible enough to be used in almost any electronic product, providing superior cooling power for the device. The heat sink also features a thermal resistance rating of 0.12°C/W, making it great for high power applications, such as server systems and power converters.
The ATS-21G-116-C3-R0 works by drawing the heat away from the electronics and dispersing it into the surrounding environment. The metal alloy in the device helps to transfer the heat away from the electronics, while the unique pattern of air flow helps to dissipate the heat more quickly. The heat sink features a die cast, stamped, and extruded metal construction, which helps to ensure low thermal resistance and excellent dissipation rates.
The ATS-21G-116-C3-R0 heat sink is a great choice for a variety of high power applications. It is highly effective at dissipating the heat of the electronic devices, while its small size and flexibility make it a great fit for devices with limited space. This makes it an ideal thermal solution for a wide range of devices, from cell phones to servers.
The specific data is subject to PDF, and the above content is for reference