| Allicdata Part #: | ATS-21G-124-C1-R0-ND |
| Manufacturer Part#: |
ATS-21G-124-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21G-124-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.16°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in the successful operation of all electronic equipment, particularly in situations where components require heat dissipation and cooling. The ATS-21G-124-C1-R0 is a thermal heat sink designed to provide a highly effective solution to the problem of removing excess heat from the operating environment. This thermal heat sink is composed of a base material and heatsink fins made from aluminum that provide maximum thermal conductivity.
The ATS-21G-124-C1-R0 is designed for use in a wide range of applications, such as industrial controllers, power supplies, automotive electronics, and general-purpose data processing equipment. The thermal heat sink is particularly well-suited for applications where air flow is limited or obstructed, as it is able to effectively manage the transfer of heat from the heat-generating components to the ambient environment.
In order to help increase the performance and longevity of electronic components, the ATS-21G-124-C1-R0 has been designed to provide superior heat dissipation efficiency. The thermal heat sink’s novel design incorporates a patented fin structure which is specially designed to maximize surface area and air flow. This enables the heat sink to dissipate up to four times more heat than traditional heat sinks. Additionally, the ATS-21G-124-C1-R0 is engineered to have a high heat transfer coefficient, meaning that heat is quickly and effectively dissipated away from the device, while never compromising the components’ dependability.
The ATS-21G-124-C1-R0 makes use of a highly advanced thermal management system in order to further strengthen its high-effective heat dissipation capabilities. The system makes use of two main cooling principles: convection and radiation. Convection is the transfer of heat directly from a hot surface to cooler, flowing air around it. Radiation is the transfer of heat directly from the device to the surrounding environment, without the need of air circulation. The thermal management system makes use of both these principles to ensure maximum efficiency.
When installed, the ATS-21G-124-C1-R0 thermal heat sink provides an extremely large surface area to conduct the heat away from the device. The system is also designed to be as low-profile as possible, enabling easy installation into cramped spaces. Additionally, the heat sink also has the capability to disperse heat with the help of a fan or similar device, providing further flexibility when trying to achieve maximum efficiency.
The ATS-21G-124-C1-R0 thermal heat sink is an excellent solution for those looking to ensure optimal operation and reliability of their electronic systems. Its sleek design and superior heat dissipation technology make it well-suited for a variety of applications, while its low profile ensures effortless installation. As a result, the ATS-21G-124-C1-R0 thermal heat sink is an excellent choice for anyone looking for an effective and reliable thermal management solution.
The specific data is subject to PDF, and the above content is for reference