ATS-21G-15-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21G-15-C3-R0-ND

Manufacturer Part#:

ATS-21G-15-C3-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21G-15-C3-R0 datasheetATS-21G-15-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.89781
30 +: $ 3.68151
50 +: $ 3.46487
100 +: $ 3.24834
250 +: $ 3.03178
500 +: $ 2.81523
1000 +: $ 2.76109
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an essential part of most electronics systems. It helps to direct heat away from the sensitive components and keep them from overheating. This is especially important in higher performance systems such as gaming rigs and servers. The ATS-21G-15-C3-R0 is an effective and reliable thermal heat sink for protecting the delicate components of these higher end systems.

The ATS-21G-15-C3-R0 is a PWM (Pulse Width Modulated) heat sink built from aluminum and designed for use in higher power systems. It features a copper base plate with numerous solder-joints, allowing for superior thermal performance. The copper base-plate makes contact with the CPU, transferring much of the heat away from the components that cannot handle the high temperature. The ATS-21G-15-C3-R0 also features an additional heat pipe which is also built from aluminum and helps to speed the heat transfer outside of the chassis.

The ATS-21G-15-C3-R0 features a number of fins on the top and bottom which are designed to dissipate the heat more evenly throughout the chassis. This helps to ensure that all components benefit from the heat sink\'s cooling. The fins are also slightly curved to help with mounting, as well as taking up less room inside the case.

The ATS-21G-15-C3-R0 is designed with two different operating modes. The first mode is the Silent Mode which helps to reduce fan noise, allowing for a quieter operating system and longer component life. The second mode is the Performance Mode which increases the speed of the fan, providing optimal cooling and higher temperatures.

The ATS-21G-15-C3-R0 is designed to help maintain greater component temperatures and help to reduce the chances of overheating and damage to electronics components. The aluminum construction and the copper base-plate also help to ensure that the heat sink can transfer heat away from the components quickly and reliably. The design also allows for installation onto customized computer cases.

When installed, the ATS-21G-15-C3-R0 is designed to provide higher heat dissipation and thermal stability and therefore improve the overall efficiency of the computer system that it is being used in. This is a crucial factor for computers running high end applications and gaming systems as it helps to ensure that the components do not overheat, helping to extend their lifespans.

The specific data is subject to PDF, and the above content is for reference

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