ATS-21G-164-C1-R0

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Thermal - Heat Sinks encompass products or solutions that use various methods to limit the amount of heat available for transfer to an ambient environment by enlarging the area over which dissipated heat is spread, increasing air flow, improving thermal conduction, or by combinations of these techniques. ATS-21G-164-C1-R0 is one type of thermal solution used for transferring heat generated by electronics.

ATS-21G-164-C1-R0 is an extrusion style heat sink specifically designed for applications such as electrical and electronic cabinets. It is designed for use in mounting custom electromechanical components or electronic devices, and for carrying temperatures of up to 80°C (176°F) safely and securely. It can also be utilized in applications which require air cooling, forced air cooling, convection cooling, and liquid cooling. The sink has a rugged aluminum construction, and can be easily mounted due to its groove and hole pattern.

The working principle of ATS-21G-164-C1-R0 is fairly straightforward. Heat dissipates from a component or device through the sidewalls of the heat-sink. The air flowing through the heat-sink then acts as a heat sink conductor – pushing heat away from the device, thus dissipating that heat to the surrounding environment. This works because the air is a poor conductor of heat, meaning that it is able to increase the distance and time over which heat is dissipated – thus providing a much greater heat-dissipation area.

In operation, the heat created by the device is transferred to the sides of the heat sink. Since the aluminum is an excellent heat conductor, this heat is then transferred to the sides of the heat-sink. This heat then either rises out of the chassis or directly over the top of the mounted component, so that it is not blocked by other nearby devices. Heat, which is generated and unable to disperse upwards, is dissipated to the fins and cooler air which is flowing over it. The fins act as a heat-removal radiator, maximizing surface area and air moving across the heat-sink in order to effectively dissipate the heat.

The combination of the heat-sink\'s design, aluminum construction, and cooling fins, effectively enable ATS-21G-164-C1-R0 to absorb and dissipate the heat generated by the electronic component or device. This helps to prolong the life of the device and allows it to perform optimally. Furthermore, due to its compact design, the ATS-21G-164-C1-R0 can be easily integrated into any application or cabinet – saving time and money during installation.

Overall, the ATS-21G-164-C1-R0 is an excellent solution for electronic cooling due to its streamlined design, excellent heat transfer, and higher capacity for air flow. As such, it can be used for a variety of applications with the assurance that it will effectively dissipate heat away from the device.

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