ATS-21G-171-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components to keep components and packages cool. ATS-21G-171-C1-R0 is a one-of-a-kind heat sink that is specially designed for use in high-power applications. This model is designed to dissipate power in excess of 300 watts. It features a larger than average foot print, allowing for a larger surface area to transfer heat. It also allows for improved air circulation, for better cooling. In addition, the model has a robust design, making it resistant to vibration and shock.

The ATS-21G-171-C1-R0\'s main components are aluminum or copper fins, which are bonded to a base plate. Aluminum fins have better heat transfer abilities than copper ones, as they dissipate heat more easily. The fins also help increase the surface area for improved cooling. The base plate helps to ensure a strong connection between the fins and the heat source. It also serves as a platform to mount other related components, such as fans.

The ATS-21G-171-C1-R0 is designed to handle power levels of up to 300 watts. It features a low profile design, which allows for improved air circulation and a larger surface area for heat transfer. The aluminum or copper fins transfer heat away from the source, while the base plate helps to ensure a good contact between the fins and the heat source. The fins are bonded to the base plate with a special adhesive, which helps to ensure the fins remain in place.

The ATS-21G-171-C1-R0 can be used in a variety of applications such as in consumer electronics, automotive, telecommunications, computer, industrial applications, and consumer devices. It is also suitable for use in military and aerospace applications, as it can withstand extreme temperatures and vibration. It is also suitable for applications involving high-frequency switching devices, as its efficiency is not affected by its small size.

The working principle of ATS-21G-171-C1-R0 is based on increasing the surface area of the heat sink. The aluminum or copper fins help to increase the surface area, thus allowing for better heat transfer. The heat is then dissipated through the air, given that the fins are constructed in such a way as to increase the airflow. The larger surface area allows for improved cooling, with less heat buildup in the air around the heat source. The fins also help to dissipate heat in a faster and more efficient manner, ensuring higher levels of heat dissipation and longer product life.

The ATS-21G-171-C1-R0 is an excellent choice for thermal management applications. It has a robust design which can withstand temperatures and vibrations. It is also lightweight and has a low profile design, allowing for improved air circulation and larger surface area for heat dissipation. Its high quality and performance make it a reliable and efficient choice for applications that require excellent heat dissipation.

The specific data is subject to PDF, and the above content is for reference