ATS-21G-181-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21G-181-C3-R0-ND

Manufacturer Part#:

ATS-21G-181-C3-R0

Price: $ 3.91
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21G-181-C3-R0 datasheetATS-21G-181-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.55131
30 +: $ 3.35370
50 +: $ 3.15643
100 +: $ 2.95917
250 +: $ 2.76189
500 +: $ 2.56462
1000 +: $ 2.51530
Stock 1000Can Ship Immediately
$ 3.91
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are an essential part of any electronic device\'s thermal management system. They are designed to absorb and dissipate heat away from the device which helps to maintain optimal performance and extend its life. The ATS-21G-181-C3-R0 heat sink is a specially-designed component that is designed for optimal thermal performance and superior reliability.

Development and Design

The ATS-21G-181-C3-R0 is a compact heat sink for use in a variety of thermal applications. It features an optimal fin design for maximum surface area and efficient heat dissipation in small areas. The exterior has a nickel-plated finish that is corrosion-resistant and adds an attractive look. The device has four mounting options available in various configurations to meet application requirements. It also has multiple convection and conduction cooling options to suit any thermal design.

Application Field

The ATS-21G-181-C3-R0 is an ideal fit for a wide variety of applications. It can be used in consumer electronics, such as desktop and laptop computers, TVs, and game consoles. It can also be used in commercial and industrial applications, such as communication equipment, medical devices, semiconductors, and security systems. The device can also be used in industrial automation and robotic systems, such as packaging equipment and production machines.

Working Principle

The ATS-21G-181-C3-R0 is designed to efficiently absorb and dissipate heat away from the device. The fins of the heat sink are designed to increase the surface area of the device which allows for more efficient heat absorption and dissipation. The fin design allows for optimal air convection which helps to keep the device running at optimal temperatures. The optimized design of the fins allows for minimal airflow restriction while still providing effective cooling performance.

Conclusion

The ATS-21G-181-C3-R0 is an essential component of any thermal management system for electronics devices. It is designed for optimal performance and superior reliability in a variety of applications. The device has a corrosion-resistant finish and multiple mounting options to suit any needs. It features an efficient fin design that allows for maximum heat absorption and dissipation while still minimizing air flow restriction. By utilizing the ATS-21G-181-C3-R0, engineers can rest assured that their thermal management system will be optimized for optimal performance.

The specific data is subject to PDF, and the above content is for reference

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