| Allicdata Part #: | ATS-21G-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-21G-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21G-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a common problem faced by engineers and designers of various industries. In most electronic applications, the power density and speed of the electronic components needs to be managed through heat dissipation. Heat sinks are one of the most important components used for this purpose. ATS-21G-20-C1-R0 is one such heat sink used for thermal management, particularly in the automotive and aerospace industry. This article discusses the application field and working principle of ATS-21G-20-C1-R0 heat sink.
Application Field of ATS-21G-20-C1-R0 Heat Sink:
The ATS-21G-20-C1-R0 heat sink is used in various automotive and aerospace applications due to its superior heat dissipation properties. The heat sink is usually placed on the processor, FPGA, or ASIC components for enhanced cooling performance. It has a low profile design, making it suitable for limited space applications. The heat sink is usually used in LED lighting solutions, laser diode systems, power supplies, RF modules, memory modules, and motherboards. It is also widely used in other applications such as electric vehicles, manufacturing robots, medical devices, and industrial control systems.
Working Principle of ATS-21G-20-C1-R0 Heat Sink:
The ATS-21G-20-C1-R0 heat sink functions on the principle of convection heat transfer. The device is a passive electronic component that helps to remove heat from other components in an electronic system. It works by dissipating heat away from the component and absorbing the energy into its surface area. The heat is then dissipated into the surrounding environment through natural convection. Heat is transferred from the component to the heat sink via conduction. The aluminum fins on the surface of the heat sink facilitate the convection process. A fan can also be used to boost the cooling performance of the device.
Conclusion:
The ATS-21G-20-C1-R0 heat sink is widely used in various automotive and aerospace applications for enhanced thermal management. It is a low profile heat sink that works on the principle of convection to dissipate heat into the environment. The aluminum fins on the heat sink facilitate the convection process and increase the cooling performance of the device. The heat sink is also suitable for limited space applications due to its thin and lightweight design.
The specific data is subject to PDF, and the above content is for reference