Allicdata Part #: | ATS-21G-20-C3-R0-ND |
Manufacturer Part#: |
ATS-21G-20-C3-R0 |
Price: | $ 4.67 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-21G-20-C3-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 4.19895 |
30 +: | $ 3.96543 |
50 +: | $ 3.73225 |
100 +: | $ 3.49896 |
250 +: | $ 3.26570 |
500 +: | $ 3.03243 |
1000 +: | $ 2.97412 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Heat sinks are a critical component in many types of modern electronic systems. They provide a control system with the ability to regulate heat distribution among individual components, allowing for effective operation over long periods of time. The ATS-21G-20-C3-R0 by Advanced Thermal Solutions, Inc. is a thermal heat sink specifically designed to meet the demanding needs of today’s high-performance computing applications.
The ATS-21G-20-C3-R0 is a short profile, low-profile aluminum heat sink featuring an optimized pure-copper base for better heat transfer and long-term thermal resistance value. The unique design offers a wealth of benefits: the air-flow-through profile ensures more efficient cooling across a range of temperatures, while the increased air exchange area gives more efficient heat transfer away from critical components.
The ATS-21G-20-C3-R0 is also designed with a built-in thermal control feature. This feature allows the heat sink to adjust itself to match the optimal thermal environment for the respective component. By adjusting the thermal environment, the heat sink is able to provide cooling to the component at the necessary levels while simultaneously providing an improved performance, higher reliability, and longer life span.
Those working with electronics know the importance of treating components correctly through heat dissipation. The ATS-21G-20-C3-R0 makes this easy by delivering effective, reliable cooling. The product also offers users a low profile, lightweight and flexible design, making it ideal for situations where tight space is an issue.
Moreover, the ATS-21G-20-C3-R0 provides its users with the ability to fine-tune their application’s thermal needs. Its onboard digital control feature allows users to configure the heat sink’s settings to regulate the temperature of the device or component it’s attached to. Users can also use this feature to adjust the fan speed, thereby increasing the fan’s efficiency and noise level.
In conclusion, the ATS-21G-20-C3-R0 is a top-quality thermally-controlled heat sink specifically designed for high-performance electronic systems. Its unique design offers improved performance, longer life, and lower noise levels. The product is lightweight and flexible enough to fit in tight spaces, while its onboard digital control provides users with the ability to fine-tune their application’s thermal needs. Heat sinks like the ATS-21G-20-C3-R0 are essential for keeping electronic components safe and operating efficiently over long periods of time.
The specific data is subject to PDF, and the above content is for reference