| Allicdata Part #: | ATS-21G-204-C3-R0-ND |
| Manufacturer Part#: |
ATS-21G-204-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21G-204-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components used to reduce the risk of overheating when components or other materials are exposed to high temperatures. In the electronics and engineering industries, a wide range of electronic components and mechanisms have to be cooled for proper operation and safety. Thermal management is a priority in the engineering design process, and therefore thermal-related components such as the ATS-21G-204-C3-R0 heat sink play an important role.
The ATS-21G-204-C3-R0 thermal-heat sink is a product of ATS Thermal Products designed for maximum performance when used in high-temperature applications. It is a highly efficient and economical heat sink designed for use with microprocessors and other circuits that require thermal management. The heat sink is made of aluminum, which is a cost-effective material for dissipating heat in high-temperature applications. This heat sink is also lightweight and easy to install on the circuit board.
The ATS-21G-204-C3-R0 has a unique design for maximum efficient heat dissipation. It has a series of fins that are arranged in a way to allow air to flow freely. This makes this heat sink able to absorb and dissipate heat quickly and easily. The fins are also designed for easy installation and are able to accommodate a wide variety of components. This makes the ATS-21G-204-C3-R0 very versatile and applicable to a number of electronic applications.
The working principle of the ATS-21G-204-C3-R0 involves the absorption of heat from an electronic component or other material, and then dissipating it away from the circuit board. It does this by using the unique fin design to transfer the heat to the surrounding air. The air is then carried away from the heat sink by convection or circulation of the cooling air. This part works to cool the circuits and components efficiently and effectively, meaning that it is applicable to a wide range of high-intensity applications.
The ATS-21G-204-C3-R0 is specifically designed to provide reliable thermal management in a wide range of high-temperature applications. This makes it a great choice for applications where maximum efficiency and performance is required. Examples of applications that could benefit from the use of this heat sink include electronics components such as microprocessors, CPUs, GPUs, and digital signal processors, as well as automotive parts or components that may need to be cooled. This type of heat sink allows these components and parts to stay cool during operation to increase efficiency and performance.
Heat sinks such as the ATS-21G-204-C3-R0 are vital for any application requiring reliable cooling and thermal management. Their unique design provides maximum efficiency and performance, while their lightweight construction and ease of installation are invaluable when it comes to choosing the right heat sink for a particular application. The versatility of these heat sinks makes them applicable to all sorts of high-intensity applications, making them a great choice for engineers and designers who are looking for a reliable and effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference