| Allicdata Part #: | ATS-21G-30-C1-R0-ND |
| Manufacturer Part#: |
ATS-21G-30-C1-R0 |
| Price: | $ 7.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21G-30-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.62760 |
| 30 +: | $ 6.25947 |
| 50 +: | $ 5.89138 |
| 100 +: | $ 5.52315 |
| 250 +: | $ 5.15494 |
| 500 +: | $ 4.78673 |
| 1000 +: | $ 4.69468 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management systems are a key component of virtually any electronic device, from small, hand-held devices to large installations. Heat sinks are an important component of these systems, and the ATS-21G-30-C1-R0 is a particularly high-quaity and reliable heat sink for larger, higher-power designs.
Heat sinks are designed to disperse the heat generated by electrical components as quickly and efficiently as possible. The ATS-21G-30-C1-R0\'s design includes a number of specific features that ensure it is capable of handling a wide variety of engineering applications. Specifically, it is capable of dissipating up to 150 watts of heat and it can be used in ambient temperatures as high as 105 degrees Celsius.
These features make the ATS-21G-30-C1-R0 suitable for a variety of applications, including in telecommunications, automotive, and industrial settings. It works especially well for applications in which the heat needs to be efficiently and quickly dissipated, such as in high power computing, server, and control room applications. Additionally, the ATS-21G-30-C1-R0 is designed for use in relatively small spaces, making it an ideal choice for space-constrained installations.
The ATS-21G-30-C1-R0\'s heat dissipation process is fairly simple and straightforward. In essence, it works by drawing ambient air through its design and then refracting some of the heat from the components inside the system. This process is especially effective when the ambient temperature is lower than the temperature of the air being refracted, as in the case of the ATS-21G-30-C1-R0\'s 105 degree maximum ambient temperature specification. This process helps ensure the heat is quickly and efficiently dissipated, allowing the electronic components to remain in optimal functioning condition.
The ATS-21G-30-C1-R0 also offers a number of additional benefits. Its design is highly durable and corrosion-resistant, allowing it to be used reliably in a wide range of applications. It is also relatively lightweight and is fairly easy to install, making it an ideal choice for a variety of designs. Finally, it is available in a variety of sizes, allowing designers the flexibility they need when choosing a heat sink for their application.
The ATS-21G-30-C1-R0 is a reliable and effective solution for dissipating heat in larger applications that demand more power. Its design is optimized for use in high-temperature, space-constrained installations, and its durability, corrosion resistance, and ease of installation make it an ideal choice for many different types of applications.
The specific data is subject to PDF, and the above content is for reference