| Allicdata Part #: | ATS-21G-46-C3-R0-ND |
| Manufacturer Part#: |
ATS-21G-46-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21G-46-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components of many electronic devices, as they help reduce temperatures of components that generate a lot of heat and prevent them from overheating. ATS-21G-46-C3-R0 is a heat sink designed to provide efficient thermal dissipation in a range of applications. Additionally, this heat sink features a unique combination of lightweight material and compact size, giving it a broad range of uses in different industries.
ATS-21G-46-C3-R0 has a single phase fin design that features a fin density of 46 fins/cm3. This heat sink has a copper base and aluminum fins, making it a great choice for applications that require good thermal performance. The base of the ATS-21G-46-C3-R0 is black anodized to increase its corrosion resistance, making it appropriate even for damp areas. Furthermore, its lightweight design offers great flexibility and adaptability in different applications, as it can be easily mounted and moved. This heat sink can be especially useful in applications where size, weight and cost are a consideration.
The principle of operation of the ATS-21G-46-C3-R0 is quite simple. Heat is generated by components in the device, such as processors, graphic cards, and other electronic components. The heat must be dissipated away from the device in order to prevent any damage or potential malfunction. The ATS-21G-46-C3-R0 heat sink helps dissipate the heat by transferring it away from the device with the help of thermal convection. Contact between the heat sink and the components is established by conductive paste, as it ensures an efficient transfer of heat and better performance.
The ATS-21G-46-C3-R0 is suitable for a wide range of applications due to its ability to dissipate heat effectively in confined spaces. This heat sink can be used in places with limited space requirements or with extreme temperatures. It can be installed in consumer electronics, medical electronics, IT, aerospace equipment, and a variety of other industries. The ATS-21G-46-C3-R0 is also a great choice for applications where weight is an important consideration, as it is lightweight and takes up minimal space.
Overall, the ATS-21G-46-C3-R0 heat sink is an ideal choice for applications that require efficient thermal dissipation in confined spaces. Its lightweight aluminium construction, corrosion resistance, and efficient fin design make it perfect for a wide range of applications and industries. With its easy installation and low cost, the ATS-21G-46-C3-R0 is a great choice for businesses looking for reliable and cost-efficient thermal performance.
The specific data is subject to PDF, and the above content is for reference