ATS-21G-58-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-21G-58-C1-R0-ND

Manufacturer Part#:

ATS-21G-58-C1-R0

Price: $ 3.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X25MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21G-58-C1-R0 datasheetATS-21G-58-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.23379
30 +: $ 3.14622
50 +: $ 2.97133
100 +: $ 2.79657
250 +: $ 2.62181
500 +: $ 2.53441
1000 +: $ 2.27223
Stock 1000Can Ship Immediately
$ 3.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.08°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks technology has come a long way since its inception. With the introduction of the ATS-21G-58-C1-R0, thermal management is more efficient and cost-effective than ever before. This cutting-edge technology was designed to provide an excellent thermal solution for all kinds of electronic components.

The ATS-21G-58-C1-R0 is a configurable designed heat sink. It is composed of multiple heat pipes, fan blades and other metal components. Its main components are a central body, including thermally active fin, housing, and cooling fins. It is made of durable metals that can withstand high temperatures and operate for long periods of time. Moreover, the structure of the heat sink is designed to provide an optimized thermal management system based on the demands of the application.

In terms of application fields, the ATS-21G-58-C1-R0 was developed for the industrial sector due to its flexibility and efficient cooling capabilities. It offers powerful thermal performance in a range of scenarios from high-powered computer systems to general electronic cooling. For instance, it can be used in data centers, communication systems, or any other environment where thermal performance is essential.

Another major advantage of this heat sink is its working principle. It uses a combination of thermal conduction and convection cooling to dissipate heat away from vulnerable electronic components. This means that as the ambient temperature rises, the heat sink passively cools and maintains a safe operating temperature for the electronic components. It is capable of regulating the temperature of the components using a single heat pipe and fan blades.

Furthermore, the ATS-21G-58-C1-R0 is capable of being configured to meet specific needs. Its modular design makes it easy to adjust the design of the heat sink to suit any given application. For instance, the cooling fins can be arranged in any desired shape or arrangement to improve the heat dissipation efficiency. This allows for customization of the product to specific customer needs, making it an ideal solution for various application scenarios.

Overall, the ATS-21G-58-C1-R0 is an innovative heat sink that offers an efficient and cost-effective solution to electronic thermal management. Its combination of thermal conduction and convection cooling, as well as its configurable design allows it to be tailored to meet the specific needs of the application. With its efficient operation and reliable performance, it is an ideal solution for industrial and general electronic cooling.

The specific data is subject to PDF, and the above content is for reference

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