| Allicdata Part #: | ATS35670-ND |
| Manufacturer Part#: |
ATS-21G-63-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21G-63-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are used as part of electronic equipment in order to keep components cool. The technology has been in use for several decades, and it is common to see heat sinks on all types of electronic equipment and consumer products. The ATS-21G-63-C2-R0 is part of the Thermal - Heat Sink category and is designed to be used in applications where extra cooling is required. This article will discuss the applications and working principles of the ATS-21G-63-C2-R0.
Applications
The ATS-21G-63-C2-R0 is designed for applications with significant cooling demands. The unit is primarily designed to provide cooling for high power components, such as CPUs, GPUs, and DSPs. The ATS-21G-63-C2-R0 utilizes a fanless design and offers a high level of cooling performance with a low acoustic profile. This makes the unit ideal for applications that require quiet operation, such as home theater receivers, audio amplifiers, and gaming systems.
The ATS-21G-63-C2-R0 is also suitable for applications where an efficient cooling solution is needed. The device utilizes a unique fluid circulation system that allows for a high level of cooling while consuming minimal power. This makes the device an ideal choice for applications that require a combination of energy efficiency and cooling performance, such as telecom and networking equipment.
The ATS-21G-63-C2-R0 is also suitable for applications that require reliable and long-term cooling performance. The device features a robust design that is designed to withstand a wide range of environmental conditions. This makes the unit well suited for applications in harsh environments, such as industrial and automotive applications.
Working Principle
The ATS-21G-63-C2-R0 utilizes a unique cooling solution in order to achieve maximum efficiency. The device is essentially a heat exchanger, which consists of two separate compartments. The first compartment is filled with a heat-conducting material, such as aluminum oxide, copper, or other thermal materials. This material is designed to absorb the heat that is generated by the components and transfer it to the second compartment.
The second compartment is filled with a liquid coolant. This coolant is circulated through a network of pipes, which is connected to a fan or a pump. As the liquid passes through the pipes, it absorbs the heat from the first compartment and disperses it into the environment. This allows the ATS-21G-63-C2-R0 to achieve a high level of cooling performance while consuming minimal power.
The ATS-21G-63-C2-R0 is designed to provide reliable cooling performance in a variety of applications. The unit utilizes an efficient cooling solution that is designed to provide consistent cooling performance without running the risk of overheating. The device is robust and can withstand a wide range of environmental conditions, making it suitable for use in harsh environments.
The ATS-21G-63-C2-R0 is a reliable and efficient cooling solution for high power components. The unit utilizes a unique cooling mechanism that is designed to provide maximum cooling performance while consuming minimal power. The device is suitable for applications that require a reliable and long-term cooling solution, such as telecommunications and networking equipment.
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