| Allicdata Part #: | ATS-21G-88-C1-R0-ND |
| Manufacturer Part#: |
ATS-21G-88-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21G-88-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks provide an essential cooling system in many modern electronic devices. Heat sinks are used to dissipate heat from components in order to protect them from overheating. There are various types of heat sinks available in the market, each with different features and applications. One such heat sink is the ATS-21G-88-C1-R0.
The ATS-21G-88-C1-R0 is a thermal heat sink designed for low-profile applications, such as hand-held consumer electronics. The heat sink is constructed with a base of aluminum that is designed to provide thermal insulation. The aluminum base is designed to have lower thermal resistance than traditional aluminum heat sinks, resulting in improved thermal performance. The heat sink also features a finned radiating surface, allowing for increased air flow to further improve thermal performance.
The ATS-21G-88-C1-R0 is designed for applications that require a low profile solution. The heat sink is ideal for applications such as cellular phones, computers, and other hand-held electronics. The heat sink is designed to be mounted directly to a printed circuit board, allowing for efficient installation and easy connection to the component being cooled. The heat sink also features an anodized finish for improved durability and corrosion resistance.
The working principle behind the ATS-21G-88-C1-R0 thermal heat sink is fairly simple. The heat generated by components in the device is dissipated through the heat sink’s radiating fin array. The aluminum base of the heat sink acts as a thermal bridge, transferring the heat from the components to the radiating fins. The fins then release the heat into the surrounding environment. The heat sink is designed to maximize the rate of heat transfer from the components to the environment, allowing the components to remain cool and functional.
In summary, the ATS-21G-88-C1-R0 is a thermal heat sink designed for low-profile applications. The heat sink is constructed of aluminum for improved thermal performance, and features an anodized finish for improved durability and corrosion resistance. The working principle of the heat sink is to transfer the heat generated by components to the radiating fin array and then to the surrounding environment. The heat sink is ideal for applications such as cellular phones, computers, and other hand-held electronics, and is designed to maximize the rate of heat transfer from the components to the environment.
The specific data is subject to PDF, and the above content is for reference