| Allicdata Part #: | ATS35711-ND |
| Manufacturer Part#: |
ATS-21H-05-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-05-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49524 |
| 25 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are frequently used in a wide range of industries to ensure the efficient and safe operation of sensitive and delicate electronics. Such solutions require high quality materials and precise engineering. ATS-21H-05-C2-R0 is an example of such engineered solutions, specifically designed for applications involving heat sinks.
Heat sinks are used to provide quick and effective cooling for high-powered electronics. Heat-generating components generate a great deal of heat, which could potentially cause irreparable damage if it reaches beyond operational limits. Heat sinks provide a way to dissipate the heat generated by these components by increasing the surface area of the component, allowing more air to flow and reduce the heat. The ATS-21H-05-C2-R0 is specifically designed to maximize this process.
The ATS-21H-05-C2-R0 has a number of features which make it an ideal choice for heat-sink applications, such as an anodized aluminum base for higher heat-dissipation capabilities, and an embedded micro-structure to prevent air voids and increase heat-dissipation efficiency. It also features a unique Contigu-Flow Technology which ensures maximum thermal transfer from the solid-state component to the heat sink surface.
The ATS-21H-05-C2-R0 also has an embedded thermal damper which helps reduce system resonance and reduce thermal runaway. This feature works by damping the heat-sink vibrational frequencies, thus increasing the heat-energy coupling efficiency and reducing overall heat gather. The micro-structure of the ATS-21H-05-C2-R0 is optimized to ensure that the heat generated by the components can be quickly and effectively transferred to the dissipating surface for improved thermal efficiency.
Due to its impressive features, the ATS-21H-05-C2-R0 is an ideal choice for a wide range of heat-sink applications. It is highly reliable due to its unique design and excellent materials, and it also provides improved thermal management through improved cooling and faster heat-energy transfer. It is cost-effective due to its competitive advantage in terms of material quality, surface area, and design features, and its thermal dampers can significantly improve the operational efficiency of the system.
Overall, the ATS-21H-05-C2-R0 is an ideal choice for thermal management applications involving heat sinks. It offers excellent thermal transfer characteristics, improved cooling, and enhanced thermal efficiency. The Conti-Flow Technology significantly reduces thermal runaway, while the embedded micro-structures improve surface area to further increase cooling efficiency. It is also highly reliable and cost-effective.
The specific data is subject to PDF, and the above content is for reference