| Allicdata Part #: | ATS35728-ND |
| Manufacturer Part#: |
ATS-21H-110-C2-R1 |
| Price: | $ 5.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-110-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.07780 |
| 10 +: | $ 4.93920 |
| 25 +: | $ 4.66452 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of any electronic device or system. One of the most common ways of ensuring proper cooling of sensitive components is through the use of heat sinks. Heat sinks are thermally conductive devices that draw heat away from sensitive components, often through the use of a fan or other airflow mechanism. The ATS-21H-110-C2-R1 is a heat sink from Advanced Thermal Solutions (ATS), designed to provide efficient cooling for high-power components.
Application Field of ATS-21H-110-C2-R1
The ATS-21H-110-C2-R1 is a high-capacity heat sink designed for applications where cooling capacity is required for higher watt components. These applications can range from consumer products such as cell phones or laptops, to mission-critical systems such as industrial automation equipment. It is suited for cooling of Power ICs, FPGAs, DC-DC converters, power modules, and other high power components. Additionally, the heat sink is compact, measuring only 110mm x 100mm x 25.4mm.
Working Principle of ATS-21H-110-C2-R1
The ATS-21H-110-C2-R1 utilizes a two-stage, active cooling system to draw heat away from sensitive components. The two-stage cooling system consists of a combined heat sink and fan assembly. The heat sink component of the system consists of an array of extruded copper fins designed to remove heat Dissipation from the component being cooled. In addition, the heat sink is embedded with two heat pipes that conduct heat away from the component, transferring it to the fin array where it can be dissipated by the airflow provided by the fan. The fan is designed to provide ample airflow to the fin array to ensure proper cooling, while featuring low-noise operation. Additionally, all components of the device are factory-assembled, which reduces installation time and risk of failure.
Conclusion
The ATS-21H-110-C2-R1 is an efficient thermal solution for cooling of high power components. It is designed for application in a variety of scenarios and is capable of providing adequate cooling while operating at low-noise levels. With its compact size, factory-assembled components, and two-stage cooling system, it is a reliable choice for thermal management of sensitive components.
The specific data is subject to PDF, and the above content is for reference