| Allicdata Part #: | ATS-21H-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-21H-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are one of the most important considerations in managing the temperature of electronics. In many cases it is necessary to add a thermal-heat sink in order to increase the cooling capacity of a device. Introducing ATS-21H-115-C1-R0 by Advanced Thermal Solutions, Inc. (ATS), it is specifically designed and manufactured to meet thermal management needs in various applications. By combining a combination of a highly effective spreader and extruded heat sink, power dissipation is maximized, while at the same time providing excellent thermal performance. The goal of ATS-21H-115-C1-R0 is to transfer heat effectively away from components and provide efficient cooling. Here is a look at what this product has to offer.
ATS-21H-115-C1-R0 Application Field
ATS-21H-115-C1-R0 is used to improve the overall thermal performance of electronics in a wide range of applications. Its main purpose is to cool down the components with their heat sinks and spreaders. As a result, ATS-21H-115-C1-R0 is found in products such as automotive electronics, industrial controls, embedded medical solutions, and LED lighting. Additionally, it can be used in commercial applications for mobile phones and tablets, computer accessories such as optical drives and display cards, and home appliances such as TV’s, air conditioners and refrigerators.
ATS-21H-115-C1-R0 Working Principle
At the heart of the ATS-21H-115-C1-R0 thermal solution is a combination of a highly effective spreader and extruded heat sink. The extruded heat sink, which features an embedded fin design, and the spreader are connected together to form an integrated thermal management solution. The air pressure is increased within the heat sink and spreader, and the flow of cooling air is directed across multiple paths to offer the most effective cooling solution.
The spreader serves as the primary component for transferring heat away from components and into the heat sink area. As cooling air passes through the spreader, the air pressure is increased in the heat sink chamber. This increase in air pressure pushes the air towards the extruded heat sink fins, which are designed to extract the greatest amount of heat from the component. The results are increased component cooling as the range of heat sink fins provide a larger surface area for the air to interact with.
The extruded heat sink fins are also designed to allow more air to travel through them compared to standard designs. This allows for a greater amount of total cooling, which in turn allows for improved component temperatures. The use of the spreader ensures that the highest amount of air pressure is generated in the heat sink chamber and in turn, the greatest amount of cooling is delivered. Additionally, the use of the spreader also helps to reduce the size of the heat sink, resulting in a more compact thermal solution.
The combination of the highly effective spreader and extruded heat sink in the ATS-21H-115-C1-R0 thermal solution help to maximize power dissipation and to effectively cool down components. The increase of air pressure within the chamber pushes the air across the extended fin design which provides excellent thermal performance. As a result, users can ensure their components and systems will stay within acceptable temperature levels.
The specific data is subject to PDF, and the above content is for reference