ATS-21H-117-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-21H-117-C1-R0-ND

Manufacturer Part#:

ATS-21H-117-C1-R0

Price: $ 3.09
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21H-117-C1-R0 datasheetATS-21H-117-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.78208
30 +: $ 2.70669
50 +: $ 2.55629
100 +: $ 2.40591
250 +: $ 2.25553
500 +: $ 2.18034
1000 +: $ 1.95479
Stock 1000Can Ship Immediately
$ 3.09
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-21H-117-C1-R0 thermal-heat sinks are designed to help dissipate heat from electrical components. These heat sinks are specifically designed to work at elevated temperatures with minimal risk of operational failure. With a wide range of applications in industrial machines, aerospace, medical, photography, and communication equipment, the ATS-21H-117-C1-R0 thermal-heat sink is well-suited for a variety of applications.

The ATS-21H-117-C1-R0 features a 3-phase symmetrical design, which helps to reduce thermal resistance and increase performance. The unit consists of three external heat dissipating fins that are arranged in a triangular orientation to maximize the heat transfer surface area. There are also four internal heat dissipating fins to increase the airflow and further reduce the internal thermal resistance. The entire heat sink is constructed from a high-density aluminum alloy for strength and heat transfer efficiency.

Heat sinks dissipate heat from electrical components by transferring it away from the component to the environment. This is done by utilizing the natural process of convection, which is the circulation of hot air and cool air. Hot air rises away from the component and cooler air moves in to replace it. This process increases air circulation and heat dissipation from the component.

Unlike most heat sinks that rely solely on convection for heat dissipation, the ATS-21H-117-C1-R0 utilizes a combination of convection, conduction, and radiation to dissipate heat away efficiently. The fins of the heat sink increase surface area, allowing them to effectively radiate heat away from the component. This helps to decrease the overall temperature of the component, making it more reliable.

The thermal-heat sink design also helps minimize the risk of overheating due to its increased surface area, high quality construction, and the elimination of mechanical/electrical failure. This minimizes operational error, reduces maintenance costs, and increases the lifespan of the component.

The ATS-21H-117-C1-R0 thermal-heat sink is an ideal choice for applications that require reliable and efficient heat dissipation. The unit is lightweight, efficient, and durable, making it perfect for industrial, aerospace, medical, photography, and communication equipment. The design and construction of the ATS-21H-117-C1-R0 thermal-heat sink guarantee reliable performance and extended lifespan.

The specific data is subject to PDF, and the above content is for reference

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