| Allicdata Part #: | ATS35773-ND |
| Manufacturer Part#: |
ATS-21H-151-C2-R0 |
| Price: | $ 4.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-151-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.88710 |
| 10 +: | $ 3.78252 |
| 25 +: | $ 3.57210 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices used to dissipate heat in order to regulate the temperature of a device or surface, keeping it at a lower temperature than its surroundings. This is accomplished through the processes of conduction, convection, and radiation. The ATS-21H-151-C2-R0 is one such heat sink, specifically designed for air cooling applications.
ATS-21H-151-C2-R0 Application Field and Working Principle
The ATS-21H-151-C2-R0 heat sink is designed to provide effective air cooling for a wide variety of applications. These include, but are not limited to, industrial, commercial, and residential cooling systems, as well as electronics cooling systems. It can be used in any situation where it is necessary to reduce the temperature of a device or surface without relying on liquid cooling systems.
The working principle of the ATS-21H-151-C2-R0 is based on the three thermal processes, conduction, convection, and radiation. The heat sink is composed of a baseplate, which is usually made of aluminum, copper, or other thermally conductive material. The baseplate is typically attached to a fin array, which is where the air cooling occurs. When the device or surface that is being cooled releases heat, that heat is transferred to the baseplate, and then to the fin array. The fins then dissipate that heat by convection and radiation into the surrounding air. This process effectively reduces the temperature of the device or surface that is being cooled.
The ATS-21H-151-C2-R0 heat sink is a cost-effective and efficient solution for air cooling applications. Its compact design requires minimal installation space, while still providing adequate cooling performance. Additionally, its aluminum construction makes it lightweight and easy to install. It is also resistant to corrosion and compatible with most standard air flow cooling systems.
Overall, the ATS-21H-151-C2-R0 heat sink is an ideal solution for air cooling applications. Its efficient performance, lightweight construction, and low cost make it an attractive option for any application where effective air cooling is needed.
The specific data is subject to PDF, and the above content is for reference