| Allicdata Part #: | ATS-21H-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-21H-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are commonly used in many different applications to transfer and dissipate heat from one object or medium to another. The ATS-21H-153-C3-R0 is an example of such a heat sink. It is designed to provide outstanding heat dissipation performance in applications where convection cooling alone would not be sufficient.
Components of the ATS-21H-153-C3-R0
The ATS-21H-153-C3-R0 is a heat sink designed specifically for applications that require superior heat dissipationperformance. The ATS-21H-153-C3-R0 comprises of several components that work together to ensure the best possible heat transfer results. It consists of an aluminum heatsink, finned with aluminum fins arranged in a checkerboard pattern, a high-density thermal pad, and a deformation plate.
Working Principle of the ATS-21H-153-C3-R0
The working principle of the ATS-21H-153-C3-R0 heat sink is based on the fact that heat always flows from a region of higher temperature to a region of lower temperature. Heat is transferred through the highly conductive aluminum finned heat sink to the atmosphere. The aluminum fins increase the contact surface area between the heat sink and the atmosphere, thus improving the rate of heat transfer. The high-density thermal pad helps to fill any gaps and provide further thermal conductivity between the heat sink and the component that is generating heat. The aluminum deformation plate helps to apply an even pressure to the thermal pad across the entire solution, thus ensuring optimal contact and heat transfer.
Applications of the ATS-21H-153-C3-R0
The ATS-21H-153-C3-R0 is ideally suited for applications that require a powerful cooling solution. It is most suitable for applications such as high-power amplifiers, server CPUs, motherboard chipsets, power amplifier ICs, and graphics cards. The ATS-21H-153-C3-R0 is designed to provide a well-balanced combination of lightness, heat dissipation efficiency, and quiet operation.
Advantages of the ATS-21H-153-C3-R0
The ATS-21H-153-C3-R0 has a number of advantages over other thermal solutions. Firstly, the aluminum heat sink provides excellent heat transfer efficiency, allowing for quicker and more efficient cooling than other materials. Secondly, the thermal performance of the ATS-21H-153-C3-R0 is much better than that of other solutions due to the use of an aluminum finned heat sink and a high-density thermal pad. Thirdly, the deformation plate ensures that the thermal pad is applied evenly and firmly throughout the solution, thus providing the best possible heat transfer results. Finally, the unique design of the ATS-21H-153-C3-R0 ensures that the solution is lightweight and quiet during operation.
Conclusion
The ATS-21H-153-C3-R0 is a thermal - heat sink designed specifically for applications requiring powerful cooling performance. Its components, working principle, applications, and advantages make it a suitable choice for a wide range of thermal solutions. This heat sink is lightweight, offers excellent heat transfer efficiency, and operates quietly when installed. For these reasons, it is a great choice for high-power amplifiers, CPUs, motherboard chipsets, power amplifier ICs, and graphics cards.
The specific data is subject to PDF, and the above content is for reference