ATS-21H-161-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.74°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-21H-161-C2-R0 is a thermal-heat sink designed to help reduce excess heat from sensitive electronic devices. Heat sinks are an integral part of any device as they provide cooling benefits to the system. Heat sinks are usually used when the environment or the device itself requires additional cooling. When it comes to the ATS-21H-161-C2-R0, it is equipped with the ability to manage high power dissipation effects without the need for active cooling solutions. With its reliable performance, it is suitable for a variety of applications with various power dissipation requirements.

Application Field

The ATS-21H-161-C2-R0 is suitable for a range of electronic applications. It is an ideal heat sink option for industrial uses, such as on robotics, robotics system parts, computers, operating systems and even consumer electronics. It is also suitable for medical core technologies, data storage and communication systems. This heat sink also serves as an excellent heat transfer solution for short-term conjunctive low power electronic components. Additionally, its thermal performance is suitable for applications that require long-term stability and reliability.

Working Principle

The ATS-21H-161-C2-R0 consists of four main components: a finned aluminum heat sink, several copper fins, a high-quality thermal grease layer and a set of thermally-efficient plastic spacers. The aluminum fins act as a heat collector and are lined with several copper fins. The copper fins will absorb heat from electronic devices and deliver it to the aluminum fins. The aluminum fins will then dissipate heat through convection. The thermal grease helps aid in the heat dissipation process by forming an additional thermal bridge between the heat source and the aluminum fins, creating a better conduction and thus a higher heat transfer rate. Finally, the plastic spacers will ensure that the heat sink is installed at the perfect height and ensure that an even air flow is generated by the fins.

Conclusion

Overall, the ATS-21H-161-C2-R0 is a highly reliable and efficient thermal heat sink that helps protect and cool sensitive electronics and devices. It is suitable for a variety of applications in the consumer electronics, medical core technologies, data storage and communication systems. With its high-quality components, reliable performance and steady heat dissipation, the ATS-21H-161-C2-R0 is an ideal heat sink for any thermal management requirement.

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