| Allicdata Part #: | ATS-21H-178-C3-R0-ND |
| Manufacturer Part#: |
ATS-21H-178-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-178-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are invaluable to thermal management in electronic devices. To achieve maximum performance they need to be expertly selected and correctly installed. Heat sinks are an essential element in the cooling process for electronic components. The Thermal Heat Sinks are the passive heat exchangers used to transfer heat from a high temp to a lower tempering environment. ATS-21H-178-C3-R0 is one of the most important products used in Thermal Heat Sinks, that has proven its efficiency and reliability in the field.
ATS-21H-178-C3-R0 is a electric thermal sink that has excellent performance on thermal heat sinks, and the design allows the unit to be mounted below the component, providing an efficient thermal solution for both large and small projects. The ATS-21H-178-C3-R0 is a Heat Sink with micro-finned high performance; constructed from aluminum copper, with a red bronze finish. The fins are grouped in a special configuration in order to distribute the heat evenly, which ensures consistent temperature levels across the entire surface area.
The Thermal Heat Sink of ATS-21H-178-C3-R0 is designed specifically to quickly move heat away from the large, hot semiconductors like CPUs, GPUs, and FPGAs. It helps to keep devices running safely, and distributing heat evenly across the entire surface area. The copper and aluminum construction of this sink guarantees excellent thermal performance and durability. It also has ContourPlusI technology that enables the design to be small and lightweight, which means this sink is ideal for space constrained applications.
In addition, this Thermal Heat Sink also offers an alternative for mounting within limited space, because it allows for mounting up to three levels above it. The mounting posts ensure stable and secure installation, while the flanges enhance the heat transfer and provide cooling to the components. As a result, the ATS-21H-178-C3-R0 is ideal for large and small projects, which require a high level of thermal performance.
The working principle for ATS-21H-178-C3-R0 is, heat is first generated in the internal components of the device and the thermal sink absorbs the heat and transfers it to the environment. By providing a large surface area for the exchange of heat, and the fins act as a barrier to help spread the heat evenly.
Overall, the ATS-21H-178-C3-R0 is an excellent thermal heat sink solution for those applications that are space constrained and require high thermal performance. It is designed to efficiently transfer heat away from the device, thus improving the overall performance. The heat transfer capability of this device is not only impressive, but also reliable, making it an ideal solution for those needing a cost effective thermal solution.
The specific data is subject to PDF, and the above content is for reference