| Allicdata Part #: | ATS-21H-180-C1-R0-ND |
| Manufacturer Part#: |
ATS-21H-180-C1-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-180-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47130 |
| 30 +: | $ 3.37743 |
| 50 +: | $ 3.18982 |
| 100 +: | $ 3.00220 |
| 250 +: | $ 2.81459 |
| 500 +: | $ 2.72077 |
| 1000 +: | $ 2.43931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is an important part of thermal management as it helps to dissipate and transfer the heat produced by electronic components and devices. The heatsink is available in a variety of sizes, shapes and configurations. ATS-21H-180-C1-R0 is one such type of heatsink which is designed for use in high-power applications with maximal heat load and performance requirements.
The ATS-21H-180-C1-R0 uses a highly efficient design to provide maximum thermal performance. It features a 180 °C high temperature tolerance and offers a large surface area for heat transfer. The heat sink is made from high grade aluminum and comes with an array of fins arranged in a circular pattern. This helps to maximize the surface area exposed to air and provides excellent heat dissipation. The fins are also designed to be optimized for air flow, which ensures optimal cooling performance. The ATS-21H-180-C1-R0 has an overall thickness of 1.551mm and the fins have a thickness of 0.20mm.
The ATS-21H-180-C1-R0 is typically used in electronic components such as power amplifiers, CPUs, FPGAs and ASICs. The heatsink is also suitable for applications where extreme temperatures are required. The performance of the ATS-21H-180-C1-R0 has been tested and it has been proven to be effective in providing thermal dissipation and heat transfer. The design can also accommodate high-power components which require higher levels of cooling performance. Additionally, this type of heat sink is lightweight and compact which makes it easy to install and maintain.
The working principle of the ATS-21H-180-C1-R0 is based on the principle of air convection. When heated, the air around the heat sink is forced to move. This convection currents then draw the heat away from the heat sink and dissipate it into the surrounding environment. As more air passes over the fins, more heat is dissipated, thus providing effective and efficient cooling performance.
The ATS-21H-180-C1-R0 also has several advantages over other types of cooling solutions. It is lightweight, compact and easy to install and maintain. It can also accommodate high-power components which require high levels of cooling performance. Additionally, the ATS-21H-180-C1-R0 has a highly efficient design which provides maximum thermal performance and can withstand extreme temperatures. All of these qualities make the ATS-21H-180-C1-R0 an ideal choice for applications where maximum performance and cooling are required.
The specific data is subject to PDF, and the above content is for reference