ATS-21H-181-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.93°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: The ATS-21H-181-C1-R0 Application Field and Working Principle

Heat sinks are devices that are used to transfer and dissipate heat away from sensitive electronic components. ATS-21H-181-C1-R0 is a type of heat sink whose application field and working principle are discussed in this article.

What is ATS-21H-181-C1-R0?

ATS-21H-181-C1-R0 is an aluminum extrusion heat sink with a 0.72-inch x 1.77-inch profile and an anodized finish to resist corrosion. It is low weight but has a high thermal conductivity and is designed for use in applications such as portable electronic devices, computers, telecom systems, and other applications where space is limited.

Application Field:

The ATS-21H-181-C1-R0 is ideal for applications such as portable electronics, computing, and telecommunications systems. This heat sink’s small size makes it ideal for tight spaces, while its high thermal conductivity ensures efficient heat dissipation. It is also well-suited for a variety of power designs, including low-power devices and high-power applications.The ATS-21H-181-C1-R0 is well-suited for applications with challenging thermal designs. Its corrosion-resistant aluminum extrusion and anodized finish increases its lifespan, while its superior thermal performance ensures efficient heat transfer and dissipation. It is also easy to assemble and fasten, making it a great choice for manufacturers who need to quickly produce a high-quality design.

Working Principle:

Heat sinks work by using the process of convection—the transfer of heat from one object to another through the circulation of fluids—to move heat away from sensitive electronic components. Convection is the process of heat moving in a circular motion, from the hotter components to cooler parts of the device, before being eventually dissipated to the surrounding air.Heat transfer within a heat sink occurs when air or a heat transfer fluid moves across the fins of the device. The high surface area of the heat fins creates more opportunity for thermal energy to transfer from the hotter parts of the device to the cooler fins. The fins then transfer heat away from the heat sink, and the air or liquid surrounding the fins dissipates the thermal energy to the surrounding environment.Heat sinks come in a variety of sizes and shapes to better suit a variety of applications. The ATS-21H-181-C1-R0 is an aluminum extrusion-type heat sink which is small but powerful enough to provide the necessary cooling capabilities for applications with tighter spaces and challenging thermal designs. Its small size and durability make it a great choice for a variety of portable electronic applications, computers, and telecom systems.In conclusion, the ATS-21H-181-C1-R0 heat sink is an efficient and effective device for dissipating heat from sensitive electronic components in applications where space is limited. Its aluminum extrusion and anodized finish make it extremely durable and corrosion-resistant while its superior thermal performance ensures efficient heat transfer and dissipation. The ATS-21H-181-C1-R0 is an ideal choice for manufacturers looking for a reliable and durable heat sink for their applications.

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