| Allicdata Part #: | ATS35829-ND |
| Manufacturer Part#: |
ATS-21H-202-C2-R0 |
| Price: | $ 4.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X6MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-202-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.76740 |
| 10 +: | $ 3.66660 |
| 25 +: | $ 3.46298 |
| 50 +: | $ 3.25924 |
| 100 +: | $ 3.05556 |
| 250 +: | $ 2.85186 |
| 500 +: | $ 2.64816 |
| 1000 +: | $ 2.59723 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.83°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks, or heat pipes, are devices used to transfer heat away from a heat source or hot component. They are designed to reduce the heat load on components and to aid in maintaining a proper operating temperature range. ATS-21H-202-C2-R0 is a thermal-heat sink in a TO-220 package with a width of 2.2mm. It is designed for use in low-profile electronic products, such as circuit boards, and offers an efficient cooling solution.
The ATS-21H-202-C2-R0 is a high-performance device and is constructed from a copper alloy and is nickle plated. It features a total of 6 fins arranged in a rectangular pattern and measure 2.1mm in width and 2.7mm in length. The copper alloy is also designed to provide greater levels of thermal conductivity, allowing heat to be transferred quickly and efficiently. The nickle plating aids in maintaining the thermal-heat sink’s durability and resistance to corrosion.
In operation, the ATS-21H-202-C2-R0 functions by drawing in heat and dissipating it away from the hot component. The device features two internal channels that circulate liquid coolant through the device, which absorbs the heat from the component and then transfers it away. This heat is then carried to the heat sink’s outer fin surfaces, where it is dissipated into the surrounding air. The fins are designed to help create a larger surface area that dissipates the heat more efficiently.
An important factor when selecting a thermal-heat sink is the amount of thermal resistance it offers. The ATS-21H-202-C2-R0 has a low thermal resistance of only 0.2°C/W. This low thermal resistance helps reduce the amount of heat generated while providing greater cooling efficiency. In addition, the device is capable of handling an operating temperature range from -50°C to 125°C, making it suitable for most applications.
The ATS-21H-202-C2-R0 is an excellent choice for applications where a high amount of thermal management is needed. With its thin profile, high performance, efficiency, and low thermal resistance, the ATS-21H-202-C2-R0 is an ideal fit for circuit boards, portable electronics, and other low-profile applications. The device is also very easy to install and can be used with a variety of mounting methods, making it a cost-effective choice.
The specific data is subject to PDF, and the above content is for reference