| Allicdata Part #: | ATS-21H-38-C3-R0-ND |
| Manufacturer Part#: |
ATS-21H-38-C3-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-38-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are used to manage and dissipate heat generated by electronic components. ATS-21H-38-C3-R0 is a heat sink specifically designed to work with high power applications. This article covers all aspects of the ATS-21H-38-C3-R0 application field and working principle for further understanding of this product.
The ATS-21H-38-C3-R0 is a heat sink designed for use in high power applications. It is capable of dissipating up to 500W of thermal energy, making it an excellent choice for applications requiring high power dissipation. It is also highly efficient in cooling, thanks to its efficient fin design and low thermal resistance. This makes it suitable for applications involving high current electronics, such as amplifiers, power supplies, power converters, and more.
The ATS-21H-38-C3-R0 is designed with a fin mounting system and is constructed with an aluminum alloy for added strength and durability. The fins are milled to a high-precision tolerance and are designed with optimized air flow channels to provide maximum cooling efficiency. This fin design also helps the efficiency of heat transfer between the component and the heat sink.
The ATS-21H-38-C3-R0 has a thermal conductivity of >2.0 W/m-K, which makes it suitable for high current electronic applications with very tight tolerance requirements. The thermal conductivity is further improved by a coating layer that is applied after the aluminum alloy is anodized, which helps reflect heat away from the component and reduce heat transfer losses.
The ATS-21H-38-C3-R0 also has a Thermal Resistance Coefficient (TRC) of <0.2 °C/W, which makes it important to understand when used for high current electronic applications. The TRC of the ATS-21H-38-C3-R0 helps to minimize heat transfer losses between the component and heat sink, making it an excellent choice for use in high power electronics. The TRC is also stable over a wide range of operating temperatures, allowing the heat sink to remain properly functioning regardless of environmental conditions.
The ATS-21H-38-C3-R0 is a highly efficient heat sink that is perfect for use in high current electronic applications that require high thermal dissipation. Its fin design provides maximum cooling efficiency and its high thermal conductivity makes it highly suitable for use in environments with tight tolerance requirements. Its stable TRC also ensures that the heat sink is able to function properly under a variety of environmental conditions. This makes the ATS-21H-38-C3-R0 an ideal choice for many high-power electronic applications.
The specific data is subject to PDF, and the above content is for reference