ATS-21H-46-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21H-46-C3-R0-ND

Manufacturer Part#:

ATS-21H-46-C3-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21H-46-C3-R0 datasheetATS-21H-46-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksThermal management is an essential component of modern product design and development. Heat sinks are used to transfer heat generated by electronic components to their environment, thus keeping the temperature of the components within their safe operating range and preventing thermal damage. The ATS-21H-46-C3-R0 is a heat sink designed to meet the needs of high-performance and low-power electronic systems. It is suitable for applications ranging from consumer and automotive electronics to industrial and aerospace systems.The ATS-21H-46-C3-R0 is a two-stage passive heat sink with overall dimensions of 46mm by 21mm. The first stage of the heat sink consists of an extruded aluminum base with two layers of small heat-dissipating fins. The second stage is an extruded aluminum lid that covers the base, creating an enclosed space for air to move within the heat sink. The base and lid are designed for optimal air movement and superior thermal performance.The ATS-21H-46-C3-R0 has two main functions in operation. The first is to allow air to flow freely and evenly over the base and the lid, which is essential for maintaining temperature stability. The second is to conduct heat away from the electronic components to the surrounding environment. The air is drawn into the heat sink by a fan, where it is heated by the components before making contact with the fins. The fins then remove the heat from the air by increasing its surface area, thus allowing it to disperse to its environment quickly and efficiently.The ATS-21H-46-C3-R0 provides a wide range of applications in the thermal management of electronic systems. Its small size makes it suitable for portable electronics such as smartphones and laptops. The low power requirements of these devices make it ideal for low-power systems such as automotive and IoT applications. Its air flow design and efficient thermal conductivity make it suitable for cooling high performance electronics such as servers and graphics cards. It is also an excellent solution for industrial and aerospace applications where increased demands on thermal management are critical.The ATS-21H-46-C3-R0 is an efficient and reliable way to keep your electronic components at safe temperatures. With its optimized design, low power requirements, and high thermal conductivity, it is an ideal solution for a wide range of thermal management applications. Whether you are looking to cool small consumer electronics, high performance servers, or aerospace systems, the ATS-21H-46-C3-R0 provides superior thermal performance.

The specific data is subject to PDF, and the above content is for reference

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