Allicdata Part #: | ATS-21H-57-C1-R0-ND |
Manufacturer Part#: |
ATS-21H-57-C1-R0 |
Price: | $ 3.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X20MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-21H-57-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.13866 |
30 +: | $ 3.05361 |
50 +: | $ 2.88401 |
100 +: | $ 2.71435 |
250 +: | $ 2.54470 |
500 +: | $ 2.45987 |
1000 +: | $ 2.20541 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal management is critical in many applications for proper operation. Thermal management systems are designed to cool and dissipate heat from sensitive electronic components. ATS-21H-57-C1-R0 is one such thermal management system specifically designed to address issues such as inadequate thermal resistance, low air flow patterns, high heat loads, and other concerns associated with heat transfer.
This thermal management system is designed to provide high efficiency performance in applications that require an affordable, high-performance solution. Based on a well-thought out design, the ATS-21H-57-C1-R0 offers superior cooling performance compared to other thermal management solutions. This thermal management system is designed to provide optimal heat dissipation through a combination of a fin-based heat dissipation design and a centrifugal air-flow pattern.
The ATS-21H-57-C1-R0 features a fin-based heat dissipation system which consists of multiple cooling fins used in a strategic pattern to optimize heat dissipation. The cooling fins are arranged to allow air to flow in and out of the heat sink in a pattern which creates a centrifugal force. This force facilitates the movement of heat away from the sensitive electronic components and into the cooling fins. The centrifugal air-flow pattern also ensures efficient cooling of the electronic components by dissipating the heat away from the components as it enters and exits the heat sink.
In addition, the ATS-21H-57-C1-R0 features a low temperature profile which prevents components from overheating in extreme environmental conditions. The heat sink is designed to maintain a low temperature profile, even in cases where the ambient temperature is much higher than the specified environmental conditions. The low temperature profile helps to ensure that sensitive electronic components are kept cool during operation, even in environments with high ambient temperatures.
The ATS-21H-57-C1-R0 thermal management system is suitable for use in a variety of environments, ranging from the traditional industrial sites to the more modern factors. Its superior design makes it suitable for both short-term and long-term use, as it provides a reliable and cost-effective solution for thermal management. This heat sink is also easy to install, as no additional hardware or tools are required for installation.
In summary, the ATS-21H-57-C1-R0 thermal management system is designed to provide superior cooling performance and heat dissipation. Its fin-based heat dissipation system and centrifugal air-flow pattern provide efficient heat dispersal and keep operating temperatures low, even in extreme environmental conditions. This thermal management system is suitable for a variety of application environments. Its cost-effective design makes it an appealing option for any business looking to keep their sensitive electronic components cool and running smoothly.
The specific data is subject to PDF, and the above content is for reference