Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.36°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

A thermal heat sink is a physical device designed to absorb excess heat from a system and transfer it away from sensitive components. The ATS-21H-60-C2-R0 is a type of thermal heat sink designed to provide maximum heat transfer away from a wide variety of applications.

Applications

The ATS-21H-60-C2-R0 is designed for thermal management in a wide range of applications and industries. businesses and industries from automotive to consumer electronics, from general industry to medical and military, can benefit from the heat sink\'s efficient design.In automotive applications, the ATS-21H-60-C2-R0 can be used for heatshielding for engine/transmission components, protection of sensitive electronics, or air-flow management of ventilation systems.Within the electronics industry, the heat sink is ideal for cooling down and protecting media components, such as processors and chipsets, as well as navigation and sound systems. It is also suitable for providing a safe temperature zone for heat-sensitive transistors and diodes.For industrial applications, the ATS-21H-60-C2-R0 heat sink can be used to maintain low temperatures for industrial ovens and presses. The heat sink is reliable and effective when it comes to preventing overheating and keeping equipment running within a safe temperature range.In the medical and military fields, the ATS-21H-60-C2-R0 is ideal for controlling thermal management in high-load systems. The heat sink is designed to dissipate heat quickly and efficiently, keeping sensitive components within a safe temperature range.

Working Principle

The ATS-21H-60-C2-R0 operates using a thermal transfer principle known as dissipative heat transfer. Heat is transferred from a hotter to a cooler surface via the process of conduction. The heat travels along a surface towards the ATS-21H-60-C2-R0’s cool surface where it is dispersed away from the application.The ATS-21H-60-C2-R0 is made up of a series of fins and heat dissipating vanes. These fins and vanes provide an increased surface area, allowing for improved heat transfer from the application. This increased surface area also allows for cooler air to flow around the heat sink, further increasing the rate of heat transfer.The ATS-21H-60-C2-R0 also uses materials designed to aid heat transfer, such as aluminum. Aluminum has superior thermal conductivity, meaning it can absorb and quickly disperse heat away from the application.The ATS-21H-60-C2-R0’s design also minimizes air pockets within the heat sink, meaning the heat transfer process is even and efficient. This minimized air flow also prevents dust and debris from gathering in the heat sink’s fins, which could reduce the efficiency of the heat transfer process.

Conclusion

The ATS-21H-60-C2-R0 thermal heat sink is a reliable and effective thermal management solution for a wide variety of applications and industries. Its efficient design and materials provide superior heat transfer, dissipating heat quickly and evenly away from the application. The ATS-21H-60-C2-R0 is an ideal choice for businesses looking for an effective thermal management solution.

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