| Allicdata Part #: | ATS-21H-79-C3-R0-ND |
| Manufacturer Part#: |
ATS-21H-79-C3-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21H-79-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-21H-79-C3-R0 is a thermal - heat sink designed for applications in which heat needs to be dissipated quickly and effectively. The heat sink works by dissipating the heat generated by electronic components into the ambient air. By transferring the heat away from the component, it is possible to prevent component overheating and ensure optimal performance.
The ATS-21H-79-C3-R0 is a highly efficient thermal - heat sink that uses a combination of materials and technologies to ensure optimal heat transfer and thermal performance. The heat sink is made up of a central core, which is made from aluminum and is surrounded by a high-thermal-conductivity material. On the sides of the core are fins made from a conductive material which dissipate heat by convection and radiation. This design is highly effective at transferring heat away from the core and dissipating it into the surrounding air. As a result, the component using the exhaustion sink can operate at a lower temperature and with greater efficiency.
The thermal - heat sink also features an internal heat transfer layer to further enhance its thermal performance. This layer is designed to absorb and transfer even more heat away from the component and out into the ambient air. It also has an air flow baffle to direct the airflow efficiently through the sink to ensure the component running at optimal temperatures. The heat of the sink is also vented down using side exhaust vents which also serve as the intake for cooler air.
The ATS-21H-79-C3-R0 is a thermal - heat sink designed for a wide range of applications. It is ideal for use in industrial, medical, military and aerospace applications where high temperatures and long running times are expected. It is also suitable for use in embedded computers, audio/video equipment and telecommunications systems. The heat sink is capable of handling temperatures up to 200°C and can dissipate more than 1100 W of heat energy.
The ATS-21H-79-C3-R0 is an effective and reliable thermal management solution that is designed to work in the harshest of conditions. Its combination of materials, technologies and design features make it an ideal thermal - heat sink for a wide range of applications. It is a highly efficient device that is capable of dissipating large amounts of heat quickly and effectively to ensure the component it is attached to runs at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference