ATS-50170B-C1-R0

Series:	maxiGRIP, maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip, Thermal Material
Shape:	Square, Angled Fins
Length:	0.669" (17.00mm)
Width:	0.669" (17.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.295" (7.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.20°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThe ATS-50170B-C1-R0 is a Thermal Heat Sink from Alpha & Omega Semiconductor (AOS). It is formed from a semi-elliptic aluminum heatsink base and clip assembly and has a standard aluminum termination to secure the applications’ operating temperature. The ATS-50170B-C1-R0 is an active thermal management system, that is designed to be used for power dissipating applications in order to reduce temperature in electronics. This Thermal Heat Sink is RoHS compliant and UL certified.Working PrincipleThe ATS-50170B-C1-R0 is designed to improve thermal efficiency and reduce system costs. It’s unique fin arrangement allows for a larger surface area and maximum contact to a heat dissipation area. This combination provides a more effective heat transfer to move the heat away from the component being cooled. The ATS-50170B-C1-R0 also uses a patent pending clip assembly which allows for a secure mounting of the component to the heatsink base. The clip also allows for easy adaptation of the thermal heat sink to various components.The thermal transfer of the heat sink works via conduction, convection and radiation. The fin geometry of the ATS-50170B-C1-R0 is engineered to maximize the transfer of heat from the component to the air. Heat is transferred from the cold junction of the component being cooled to the base of the heatsink where it is spread out by a mechanical force transfer called conduction. The fin geometry provides for a flow of air to be forced up through the fins, aiding in the conduction process. Heat from the base of the aluminum heatsink is then transferred to the air by convection through the medium of air. Finally, any additional heat from the component is transferred to the air via radiation, which is dependent on the surface area of the exposed heatsink.ApplicationsThe ATS-50170B-C1-R0 Thermal Heat Sink can be used in applications such as amplifiers, IGBT modules, LED lighting, RF power devices, and DC-DC converters. The aluminum heatsink base and clip assembly provide superior thermal performance and system cost savings.Some of the applications for the ATS-50170B-C1-R0 include automotive electronics, LED lighting, RF amplifiers, and semiconductor devices. Automotive electronics have become increasingly sophisticated, and electronic systems in cars are now required to handle higher electric power. If these circuits are exposed to high temperatures, their performance can suffer significantly. The ATS-50170B-C1-R0 Thermal Heat Sink can help in these applications as it can reduce system temperatures significantly due to its effective thermal performance.LED lighting generally requires a robust thermal management solution in order to operate effectively and increase the life of the system. The ATS-50170B-C1-R0 Thermal Heat Sink offers a cost effective solution by providing highly efficient thermal dissipation, reducing the operating temperature of the LEDs.RF amplifiers are used in radio devices and require a reliable thermal solution due to their high power and high operating temperatures. The ATS-50170B-C1-R0 Thermal Heat Sink is the perfect solution for this application as it provides superior heat transfer performance, reducing the maximum operating temperature of the system.Finally, DC-DC converters are sensitive devices that require precise control of temperature variations in order to maintain optimum operation. The ATS-50170B-C1-R0 Thermal Heat Sink helps to reduce temperature swings for improved system performance. ConclusionThe ATS-50170B-C1-R0 Thermal Heat Sink is a great solution for many thermal management needs. The semi-elliptic aluminum heatsink base and clip assembly provide superior heat transfer performance, allowing the temperature of the component to be significantly reduced. The easy adaptation of the heat sink to various components makes it a suitable solution for a variety of applications, such as automotive electronics, LED lighting, RF amplifiers, and DC-DC converters. As it is RoHS compliant and UL certified, the ATS-50170B-C1-R0 makes for a reliable and cost effective solution.

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