| Allicdata Part #: | ATS1016-ND |
| Manufacturer Part#: |
ATS-50170G-C1-R0 |
| Price: | $ 6.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 17MM X 17MM X 12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50170G-C1-R0 Datasheet/PDF |
| Quantity: | 93 |
| 1 +: | $ 6.14250 |
| 10 +: | $ 5.97870 |
| 25 +: | $ 5.64656 |
| 50 +: | $ 5.31443 |
| 100 +: | $ 4.98223 |
| 250 +: | $ 4.65008 |
| 500 +: | $ 4.31793 |
| 1000 +: | $ 4.23489 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 0.669" (17.00mm) |
| Width: | 0.669" (17.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions are essential components in any electronic devices. Heat sinks are one of the most commonly used thermal management products to dissipate heat from high power electronic devices. In this article, we will discuss the field of application and working principle of ATS-50170G-C1-R0 thermal-heat sink.
The ATS-50170G-C1-R0 is a single-sided extruded aluminum heat sink with nominal dimensions of 500mmx170mmx50mm, featuring superior thermal performance. It is designed specifically for fast-switching static switches and DC-DC converters in telecom, automotive, industrial and medical applications. The ATS-50170G-C1-R0 heat sink features a black anodized finish, a fin thickness of 0.5mm, a surface area of 3.19 cm2 and an R th of 0.5°C/W.
The working principle of the ATS-50170G-C1-R0 is largely based on the convection cooling process. Heat is generated from the device and then transferred to the heat sink by conduction. The heat sink absorbs the heat and dissipates it through natural convection forces in the surrounding air. Natural convection occurs when hot air rises away from the heat sink and is replenished by cooler air. The cooling process is accelerated by the fin structure on the heat sink, which increases the surface area and therefore the amount of air that can flow around the heat sink.
The ATS-50170G-C1-R0 heat sink also features a fan kit, which supports additional cooling. The fan kit consists of a fan shroud and two 120 x 25 mm fans with a ball bearing. The fans are designed to efficiently move air through the fin structure and allow for higher airflow than natural convection alone. This allows the heat sink to effectively dissipate even more heat than when using natural convection alone.
The ATS-50170G-C1-R0heat sink is also designed to be compatible with high power static switches and DC-DC converters. This compatibility is made possible by the use of two mounting holes located on the baseplate of the heat sink. These two mounting holes provide compatibility with a variety of high power static switches and DC-DC converters. This ensures that the heat sink can be used with a wide range of devices.
In summary, the ATS-50170G-C1-R0 heat sink is a single-sided extruded aluminum heat sink with superior thermal performance. It is designed with a natural convection cooling process and features a black anodized finish, fin thickness of 0.5mm, surface area of 3.19 cm2 and R th of 0.5°C/W. The fan kit provides additional cooling abilities. The two mounting holes provide compatibility with a variety of high power static switches and DC-DC converters. This makes it an ideal solution for telecommunication, automotive, industrial and medical applications.
The specific data is subject to PDF, and the above content is for reference