| Allicdata Part #: | ATS1001-ND |
| Manufacturer Part#: |
ATS-50190B-C1-R0 |
| Price: | $ 6.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 19MM X 19MM X 7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50190B-C1-R0 Datasheet/PDF |
| Quantity: | 283 |
| 1 +: | $ 5.73300 |
| 10 +: | $ 5.57802 |
| 25 +: | $ 5.26781 |
| 50 +: | $ 4.95810 |
| 100 +: | $ 4.64820 |
| 250 +: | $ 4.33831 |
| 500 +: | $ 4.02842 |
| 1000 +: | $ 3.95095 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 0.748" (19.00mm) |
| Width: | 0.748" (19.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
The ATS-50190B-C1-R0 is a device designed to dissipate energy through a process known as heat sinking. Heat sinking is used to efficiently transfer thermal energy away from components to keep them from overheating. With this device, the thermal energy is dissipatedMore-efficiently-via-heat-sinking and the more powerful the device, the more efficient it becomes.
The ATS-50190B-C1-R0 is primarily used in electronic devices, but can also be found in industrial applications such as server farms and cooling systems. This device is constructed from aluminum profiles with a black anodized finish and features a CNC machined heat sink that has been anodized to give it a smooth and shiny surface. The heat sink provides an efficient thermal conductivity between the device\'s components and its environment, allowing the efficient transfer of heat away from the components.
The ATS-50190B-C1-R0 is a powerful device with an impressive range of applications. It can be used for cooling and dissipating thermal energy from CPUs, GPUs, and other electronic components. It can also be used to dissipate heat from a variety of industrial applications such as server farms, dampers, and other heavy-duty thermal projects. Additionally, it can be used for cooling high-end GPUs and gaming consoles.
The ATS-50190B-C1-R0 works in two ways: by transferring heat away from components and by regulating the heat of the surrounding air. The heat sink works by utilizing a combination of convection and air cooling techniques. The convection technique uses air movement to transfer heat away from the component, while the air cooling technique uses fans to circulate air around the device and control its temperature. This allows the device to effectively manage the thermal energy and prevents overheating.
The ATS-50190B-C1-R0 is a reliable and efficient device that can be used for a variety of applications. With its impressive range of applications, it is no wonder it is such a popular choice among users. It is easy to install and can be used in a variety of environments, making it a great choice for any application. With its efficient thermal dissipation techniques, it is the perfect device for keeping electronic components cool and safe.
The specific data is subject to PDF, and the above content is for reference