| Allicdata Part #: | ATS1034-ND |
| Manufacturer Part#: |
ATS-50210P-C1-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 21MM X 21MM X 17.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50210P-C1-R0 Datasheet/PDF |
| Quantity: | 67 |
| 1 +: | $ 6.80400 |
| 10 +: | $ 6.62004 |
| 25 +: | $ 6.25237 |
| 50 +: | $ 5.88445 |
| 100 +: | $ 5.51672 |
| 250 +: | $ 5.14894 |
| 500 +: | $ 4.78116 |
| 1000 +: | $ 4.68922 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 0.827" (21.00mm) |
| Width: | 0.827" (21.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal conductivity plays a pivotal role in the efficiency of a device or system. Without proper cooling, a device and the components that comprise it can become damaged over time due to excessive heat. Heat sinks are used to increase the rate at which heat can be dissipated from a heated object or system. There are various types of heat sinks available on the market, with the ATS-50210P-C1-R0 being one of the most efficient and reliable models.
The ATS-50210P-C1-R0 is designed to provide superior cooling capabilities within a variety of applications. This model is effectively designed to dissipate heat quickly and evenly, which is why it is a great choice for use in thermal regulation systems, industrial cooling systems, and other applications where heat dissipation is critical.
The ATS-50210P-C1-R0 consists of two plates—a cold plate and a hot plate. The cold plate is made of a thermally conductive material such as aluminum or copper and is effective at drawing heat away from the device or system. The hot plate is also made of thermally conductive material, but its primary purpose is to expel the heat it absorbs from the device or system. This model also features an integrated air deflector to ensure optimized heat dissipation.
In addition to helping dissipate heat from a system or device, the ATS-50210P-C1-R0 also helps protect the delicate components of such devices. The integrated air deflector helps keep the system’s components protected from direct exposure to warm air, which can lead to increased wear-and-tear and even system failure.
The ATS-50210P-C1-R0 also helps maintain adequate airflow, which helps prevent the creation of hot spots. Hot spots can occur when heat from a system builds up in certain areas, which can lead to system malfunction. The integrated air deflector helps ensure that the air flow is evenly distributed across the device, helping reduce the potential for hot spots.
The ATS-50210P-C1-R0 can also be used to improve device performance in different scenarios. By dissipating heat quickly and evenly, the device will remain cooler, which can help improve the speed and reliability of the device or system. This model also helps maintain adequate airflow, which can help ensure all components in the system are receiving the proper amount of air cooling.
Overall, the ATS-50210P-C1-R0 is an excellent choice for thermal regulation and cooling systems, as it offers superior performance within a variety of applications. Its integrated air deflector and thermally conductive material make it an ideal choice for maintaining optimum cooling, while also protecting sensitive components from heat damage. All of these features combine to make the ATS-50210P-C1-R0 one of the most reliable and efficient models on the market.
The specific data is subject to PDF, and the above content is for reference