| Allicdata Part #: | ATS1020-ND |
| Manufacturer Part#: |
ATS-50250G-C1-R0 |
| Price: | $ 7.04 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 25MM X 25MM X 12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50250G-C1-R0 Datasheet/PDF |
| Quantity: | 979 |
| 1 +: | $ 6.40080 |
| 10 +: | $ 6.23070 |
| 25 +: | $ 5.88445 |
| 50 +: | $ 5.53833 |
| 100 +: | $ 5.19221 |
| 250 +: | $ 4.84606 |
| 500 +: | $ 4.49992 |
| 1000 +: | $ 4.41337 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal solutions like heat sinks are important components for electronic systems. Using an effective heat sink can significantly reduce the risk of electronic equipment malfunction, component failure and even fire risk due to excessive temperatures. The Thermal-Heat Sinks like ATS-50250G-C1-R0 is an iconic example in this industry.
The ATS-50250G-C1-R0 Heat Sink is specially designed for applications in high-precision digital technology, military, aerospace, industrial, integrated circuit, etc. The sink features both a miniature profile and fanless operation. It has a low profile design, low noise and excellent thermal conductivity, making it ideal for applications requiring low noise and space savings. The sink is made with a metal core, the structure of which allows heat to be quickly and evenly distributed.
The ATS-50250G-C1-R0 heat sink provides efficient cooling via its combination of a metal core and fanless construction. The construction itself dissipates the heat, allowing the heat sink to remain at a steady temperature, even during extended periods of use. The sink also includes a finned surface that aids air flow, allowing the heat to dissipate more quickly and evenly.
The ATS-50250G-C1-R0 heat sink is also especially suited for high-density circuit boards and microprocessors. Its fully enclosed fanless design prevents dust and other debris from entering the enclosure through the fan, which helps to reduce the risk of system malfunction. Additionally, its low-profile design allows the sink to fit in tight spaces, such as those found in high-density circuit boards.
In addition to its excellent cooling capabilities, the ATS-50250G-C1-R0 heat sink also features an advanced thermal management system. This helps to maintain the sink’s ideal operating temperature, while also allowing the system to quickly and easily adjust its thermal profile in response to changing temperatures. This feature also helps to protect the system from overheating by allowing the system to adjust the cooling power in response to temperature changes.
The ATS-50250G-C1-R0 heat sink is basically a fanless solution for a wide range of applications requiring high thermal management and low noise output. The low profile design and zero-maintenance fanless system allows the sink to be installed in a variety of locations, from a desktop to the under-floor or rear projection enclosure. The sink is also backed by a 5-year warranty, providing peace of mind and assurance in regards to its reliability and durability.
The specific data is subject to PDF, and the above content is for reference