| Allicdata Part #: | ATS-50310B-C0-R0-ND |
| Manufacturer Part#: |
ATS-50310B-C0-R0 |
| Price: | $ 6.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 31MM X 31MM X 7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50310B-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.03792 |
| 30 +: | $ 5.70234 |
| 50 +: | $ 5.36697 |
| 100 +: | $ 5.03156 |
| 250 +: | $ 4.69612 |
| 500 +: | $ 4.36068 |
| 1000 +: | $ 4.27682 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Angled Fins |
| Length: | 1.220" (30.99mm) |
| Width: | 1.220" (30.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-50310B-C0-R0 is a type of thermal-heat sink that is designed for surface mount applications. The main purpose of a thermal-heat sink is to transfer generated heat away from a device or circuitry that is sensitive to overheating, often used in the electronics industry. Heat sinks are used for cooling electronic components, regulating temperatures in computers and other equipment and protecting high-power components.
The ATS-50310B-C0-R0 has a revolutionary design that allows it to operate in tight spaces and provide increased thermal efficiency. The thermal-heat sink features four panels with integrated cooled copper plate and fins that are thermally bonded to the base using thermal grease, effectively increasing heat dissipation.
The ATS-50310B-C0-R0 has an aluminium base that is fabricated out of durable and lightweight material. An added advantage is that the aluminium base is UV and corrosion-resistant, so it can retain its cooling properties over an extended period of time. A large number of thermal-heat sinks have fins that conduct heat away from the critical device, or chipset, quickly and efficiently while occupying minimal space.
The working principle of the ATS-50310B-C0-R0 is fairly straightforward. When power is applied to a device or circuitry, electrons flow through the device or circuitry and generate heat. This heat is then dissipated through the thermal-heat sink. Heat is transferred from the device or circuitry to the fins of the thermal-heat sink which in turn conduct it away, cooling the device or circuitry in the process.
The thermal-heat sink is designed to promote air flow through the fins, enabling the heat that is conducted away from the device or circuitry to be more efficiently dispersed. The fins act like a chimney, bringing warmer air up from the bottom of the thermal-heat sink and expelling it out of the top. This helps to create an efficient air flow that cools the critical device or chipset more quickly and consistently.
The ATS-50310B-C0-R0 is a valuable part in many electronic devices and can help ensure that temperatures remain within a safe range. This thermal-heat sink is an ideal solution for applications with limited space, providing increased thermal efficiency in the shortest amount of time.
The specific data is subject to PDF, and the above content is for reference