ATS-50310P-C1-R0

Series:	maxiGRIP, maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip, Thermal Material
Shape:	Square, Angled Fins
Length:	1.220" (30.99mm)
Width:	1.220" (30.99mm)
Diameter:	--
Height Off Base (Height of Fin):	0.689" (17.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.30°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-50310P-C1-R0 thermal heat sink is a thermal component used in electronic applications to transfer heat away from components and other sensitive areas. It works by drawing heat away from the source and dissipating it into the surrounding air, thus cooling the device. The ATS-50310P-C1-R0 is a thermal component designed for low-noise and high efficiency. The device’s features help it to perform well in a wide variety of cooling applications.

Performance Characteristics

The ATS-50310P-C1-R0 is designed to transfer heat through conduction, convection, and radiation processes. It utilizes a patented design that allows for increased cooling efficiency and lower noise levels. It features an anodized aluminum structure, which helps to dissipate heat quickly and evenly. The device is lightweight and easy to install, and its low profile design enables it to be used in confined spaces. The ATS-50310P-C1-R0 also features heat pipes, which help to transfer heat quickly and efficiently away from the device.The ATS-50310P-C1-R0 has a wide range of performance characteristics, including a high heat transfer rate, low noise levels, and fast thermal transfer. It is also designed to be reliable and durable, with a long service life. The device has a wide heat dissipation range, from 5 to 30 watts, making it suitable for a variety of applications. The ATS-50310P-C1-R0 is also capable of operating at temperatures up to 50 degrees Celsius.

Applications

The ATS-50310P-C1-R0 is an excellent choice for cooling a variety of electronic components, such as CPUs, GPUs, memory, and other sensitive components. It is also suitable for cooling servers, embedded system devices, and other electronic systems. Due to its low noise levels and high heat transfer rate, the device can also be used in medical equipment and industrial applications, where noise levels must be kept low.

Work Principle

The ATS-50310P-C1-R0 utilizes a combination of conduction, convection, and radiation to dissipate heat away from the device. Heat is transferred from the source to the ATS-50310P-C1-R0 heat sink through conduction and then dissipated into the surrounding air through convection. The radiation process helps to further dissipate heat by radiating it away from the device. The device also uses heat pipes to quickly and efficiently transfer heat away from the source, helping to maintain cooler temperatures in the environment.

Conclusion

The ATS-50310P-C1-R0 is a thermal component designed for low-noise and high efficiency cooling applications. It features an anodized aluminum structure, heat pipes, and a wide heat dissipation range, making it suitable for a variety of electronic applications. The device utilizes a combination of conduction, convection, and radiation processes to dissipate heat away from the device and maintain cooler temperatures in the environment. The ATS-50310P-C1-R0 is an ideal choice for cooling a variety of sensitive electronic equipment and medical systems.

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