| Allicdata Part #: | ATS1009-ND |
| Manufacturer Part#: |
ATS-50325B-C1-R0 |
| Price: | $ 6.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 32.5 X 32.5 X 7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50325B-C1-R0 Datasheet/PDF |
| Quantity: | 88 |
| 1 +: | $ 6.20550 |
| 10 +: | $ 6.03603 |
| 25 +: | $ 5.70049 |
| 50 +: | $ 5.36533 |
| 100 +: | $ 5.02998 |
| 250 +: | $ 4.69463 |
| 500 +: | $ 4.35930 |
| 1000 +: | $ 4.27546 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks come in various shapes and sizes, each designed to serve a different purpose. The ATS-50325B-C1-R0 is a heat sink designed for thermally challenging applications. This article will explain the application field and working principle of ATS-50325B-C1-R0, and discuss the various types of thermal materials used in its construction.
Application Field
ATS-50325B-C1-R0 is designed for use in high-power electronics such as VRMs, CPUs, GPUs, and system-on-chips. Its densely packed fin design provides maximum heat dissipation, enabling it to handle thermally challenging applications.
Working Principle
The ATS-50325B-C1-R0 heat sink works by operating on the principle of convection and conduction. Hot air is drawn away from the heat source by extending the fins of the heat sink into the air stream. The fins then dissipate this heat by transferring it to their cooler surfaces, thus cooling the surrounding air. The heat sink\'s densely packed design allows for an increased surface area, maximizing its ability to dissipate heat quickly and efficiently.
Thermal Materials
The ATS-50325B-C1-R0 heat sink is constructed using high-temperature, low-expansion thermal materials such as aluminum and copper. These materials are highly conductive but have low thermal expansion, meaning that they will not warp under high temperatures. These materials enable the heat sink to dissipate heat quickly and efficiently, thus ensuring its reliability and performance.
The ATS-50325B-C1-R0 is a reliable and efficient heat sink designed for thermally challenging applications. Its densely packed fin design provides maximum heat dissipation, enabling it to handle thermally challenging applications. It operates on the principle of convection and conduction, drawing hot air away from the heat source and transferring it to its cooler surfaces. Additionally, the heat sink is constructed using high-temperature, low-expansion thermal materials such as aluminum and copper, ensuring its reliability and performance.
The specific data is subject to PDF, and the above content is for reference