Allicdata Part #: | ATS1010-ND |
Manufacturer Part#: |
ATS-50330B-C1-R0 |
Price: | $ 6.86 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEAT SINK 33MM X 33MM X 7.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-50330B-C1-R0 Datasheet/PDF |
Quantity: | 100 |
1 +: | $ 6.23700 |
10 +: | $ 6.07005 |
25 +: | $ 5.73300 |
50 +: | $ 5.39582 |
100 +: | $ 5.05859 |
250 +: | $ 4.72135 |
500 +: | $ 4.38411 |
1000 +: | $ 4.29980 |
Series: | maxiGRIP, maxiFLOW |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip, Thermal Material |
Shape: | Square, Angled Fins |
Length: | 1.299" (32.99mm) |
Width: | 1.299" (32.99mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.295" (7.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.80°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal solutions are essential for any electric product; it is essential to have a reliable, cost effective and well-engineered cooling system in order to ensure the product can perform efficiently. The ATS-50330B-C1-R0 is an innovative thermal heat sink that is designed to meet the needs of a variety of application fields.
The ATS-50330B-C1-R0 is a black anodized aluminum heat sink combination that is designed for air cooling of printed circuit boards, surface mounted components, and even larger items such as CPUs, memory chips, and other components. The heat sink features a conical fin design which increases the cooling region and improves transfer of heat away from the components. The thermal transition capacity of is achieved through the efficient and effective use of radial fins and the extended cooling surface area. By utilizing the spread and efficient air-flow, this product is able to ensure that the safe thermal operation temperature is maintained at all times.
In addition to the advanced fin design, the ATS-50330B-C1-R0 has a series of innovative and advanced features that help it stand out from other similar products. It is designed with a multiple termination points that allow for easy mounting and the ability to accommodate any board semiconductor. The product also features an internal honeycomb structure, which helps to minimize noise and interference that can be caused by inadequate cooling. In addition, the ATS-50330B-C1-R0 is designed with nut and bolt grooves that permit easy installation to any board or component requiring fastening. This feature also assists in increasing the contact between the heat sink and the component, thereby helping to reduce air flow impediments.
The ATS-50330B-C1-R0 is also designed as an efficient and reliable thermal solution. It is designed to operate with minimal power consumption and maximum heat transfer efficiency. It has a high thermal transfer rate that helps to reduce power losses caused by poor heat dissipation. In addition, the product is designed to be durable and corrosion resistant, making it an ideal choice for use in harsh environments. Moreover, the product is designed with a low thermal resistance which ensures that maximum energy efficiency is achieved.
The ATS-50330B-C1-R0 is an advanced and efficient thermal heat sink with numerous features that make it ideal for any application field. With its novel design elements and high performance capabilities, this product is a reliable and cost-effective solution for any electric product.
The specific data is subject to PDF, and the above content is for reference