| Allicdata Part #: | ATS1026-ND |
| Manufacturer Part#: |
ATS-50330G-C1-R0 |
| Price: | $ 7.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 33MM X 33MM X 12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50330G-C1-R0 Datasheet/PDF |
| Quantity: | 157 |
| 1 +: | $ 6.75990 |
| 10 +: | $ 6.57405 |
| 25 +: | $ 6.20903 |
| 50 +: | $ 5.84375 |
| 100 +: | $ 5.47854 |
| 250 +: | $ 5.11330 |
| 500 +: | $ 4.74807 |
| 1000 +: | $ 4.65676 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical part of any electronic system, as it helps keep the device and its parts in proper working condition. Heat sinks are a common type of thermal management device used in many electronic systems. ATS-50330G-C1-R0 is a type of heat sink that is specifically designed for use in low-power cooling applications. This article will discuss the application field and working principle of the ATS-50330G-C1-R0 heat sink.
The ATS-50330G-C1-R0 is designed for use with low-power devices such as microcontrollers, CPUs, FPGAs, and ASICs. It is also suitable for use with other components, such as SMD LEDs, which require low-power cooling. The ATS-50330G-C1-R0 heat sink has a base made of extruded aluminum with a clip design to easily attach to the component. The fins of the heat sink are made of stamped aluminum, which provides maximum air flow to allow for efficient cooling.
The main function of a heat sink is to dissipate heat from the component. As heat is applied to the component, it is transferred to the heat sink through convection. The heat sink then dissipates the heat into the ambient environment. This is done through a process called thermal conduction. This process works by having the heat sink act as an air-filled chamber that is in direct contact with the component, thus allowing the heat to be transferred from the component to the fins of the heat sink.
The ATS-50330G-C1-R0 heat sink has an effective thermal resistance of 1.229°C/W and a thermal impedance of 0.351°C/W. It also features a low profile design that makes it ideal for applications where height is a concern. Additionally, the heat sink is designed with a small inlet and outlet gap to allow maximum air flow for improved cooling.
The ATS-50330G-C1-R0 heat sink is designed for an ambient temperature range of 5°C to 50°C. Its design ensures that it is able to efficiently dissipate heat, even in the most extreme conditions. It is also resistant to corrosion and is RoHS compliant.
The ATS-50330G-C1-R0 heat sink is designed to be a cost-effective solution for cooling low-power applications. Its small size and easy installation make it an ideal choice for many devices. Additionally, its low profile design makes it suitable for applications where height and space are restricted. This makes it an excellent choice for applications such as microcontrollers, CPUs, FPGAs, and ASICs.
The specific data is subject to PDF, and the above content is for reference