| Allicdata Part #: | ATS1042-ND |
| Manufacturer Part#: |
ATS-50330P-C1-R0 |
| Price: | $ 7.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 33MM X 33MM X 17.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50330P-C1-R0 Datasheet/PDF |
| Quantity: | 76 |
| 1 +: | $ 7.13790 |
| 10 +: | $ 6.73911 |
| 25 +: | $ 6.34259 |
| 50 +: | $ 5.94619 |
| 100 +: | $ 5.54980 |
| 250 +: | $ 5.15340 |
| 500 +: | $ 5.05429 |
| 1000 +: | $ 4.95519 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-50330P-C1-R0 thermal - heat sink is an ideal solution for applications such as microprocessors, memory modules, power amplifiers, and I/O devices. It is a low profile, low cost, highly efficient, and reliable heat management solution. The thermal - heat sink has a flat surface that is perfect for evenly distributing the heat and maximizing cooling performance.
The ATS-50330P-C1-R0 thermal - heat sink is designed to be used in a variety of industries, including the medical, automotive, industrial, and consumer electronics fields. It provides superior cooling performance while keeping the system operating at optimal levels of performance. The heat sink is made of aluminium, which provides excellent heat conductivity and dissipation, as well as resistance to corrosion and oxidation.
The ATS-50330P-C1-R0 thermal - heat sink is designed for use with a variety of thermal transfer interfaces, such as a Heat Pipe or Heat Exchanger. Heat pipes are designed to transfer heat from one point, such as the processor, to another, such as a heat sink orCooling Tower. Heat Exchangers are used to exchange and spread heat from a hot spot to allow cooling of the system as a whole by spreading the heat over a large area.
The ATS-50330P-C1-R0 thermal - heat sink features a high performance, finned design that effectively increases the rate of heat transfer from the hot spots to the surrounding environment. The fins are designed to provide an extended surface area that allows more air to be pulled into the system, improving the heat dissipation. The heat sink also features embedded temperature control devices that allow for efficient cooling. The ATS-50330P-C1-R0 thermal - heat sink is designed to be used in environments where a lot of heat is generated and significant cooling is needed.
The ATS-50330P-C1-R0 thermal - heat sink has a low installation profile and easy installation process. It requires minimal setup and maintenance and requires only basic tools and materials for installation. The heat sink is designed with two mounting points to allow for easy installation in various system configurations. The ATS-50330P-C1-R0 thermal - heat sink can be used in environments where noise could be an issue, as it has been designed to operate silently.
The ATS-50330P-C1-R0 thermal - heat sink also features multi-zone optimized performance. Multiple zones in the design target different areas of the system, allowing for tailored cooling performance for specific parts of the system. The heat sink features an efficient thermal management system, allowing for low-voltage operation to keep power consumption to a minimum and heat dissipation to a maximum.
The ATS-50330P-C1-R0 thermal - heat sink is designed for optimal performance in a variety of applications, making it an ideal solution for a wide range of industries. It is designed with a low profile, low cost, and high-efficiency design that provides superior cooling performance and reliable heat management. It is also easy to install, requires minimal maintenance, and is silent in operation. With its multi-zone design, it’s optimized for various parts of the system for tailored cooling performance.
The specific data is subject to PDF, and the above content is for reference