| Allicdata Part #: | ATS-50350P-C3-R0-ND |
| Manufacturer Part#: |
ATS-50350P-C3-R0 |
| Price: | $ 8.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 31MM X 31MM X 12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50350P-C3-R0 Datasheet/PDF |
| Quantity: | 356 |
| 1 +: | $ 8.05140 |
| 10 +: | $ 7.60473 |
| 25 +: | $ 7.15708 |
| 50 +: | $ 6.70975 |
| 100 +: | $ 6.26245 |
| 250 +: | $ 5.81515 |
| 500 +: | $ 5.70331 |
| 1000 +: | $ 5.59149 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-50350P-C3-R0 is an advanced thermal heat sink designed to provide superior cooling and thermal management solutions in a wide range of applications. Thermal heat sinks are typically used for dissipating heat away from components, such as microprocessors, memory, and other integrated circuits. The ATS-50350P-C3-R0 features a unique design that combines both air- and liquid-cooling systems, resulting in effective and efficient heat dissipation. Additionally, the heat sink is designed to provide an easily adjustable airflow to ensure optimal thermal management.
The ATS-50350P-C3-R0 is a high-performance thermal heat sink, specifically engineered for high-performance applications. The heat sink is designed to dissipate extreme amounts of heat from sensitive components, such as electronics, as well as provide increased cooling efficiency and longevity of the components. The device is constructed using high-grade aluminum, which is extremely durable and offers superior thermal management. Additionally, the heat sink features a unique air-flow design, which ensures that heat is dissipated efficiently and quickly.
The ATS-50350P-C3-R0 is designed with an array of features that enhance its cooling capability and performance. The heat sink includes a series of fins that are spaced out in such a way that they increase the overall surface area of the heat sink chassis. These fins allow for greater air exchange between the heat sink chassis and the components that it is cooling, resulting in increased cooling efficiency. Additionally, the device features an adjustable fan speed control, which allows users to fine-tune the speed of the airflow to optimize cooling performance.
The ATS-50350P-C3-R0 is designed to provide efficient cooling solutions in a wide variety of applications. It is especially well-suited for use in industrial settings and electronic devices, where intense heat must be quickly and effectively dissipated. The device can be used for improving the operational longevity, energy efficiency, and reliability of components in such applications. Additionally, the device is designed to provide excellent heat dissipation even in harsh environments.
The ATS-50350P-C3-R0 is a highly efficient thermal heat sink, engineered for use in high-performance applications. The device is designed with a series of features that ensure fast and efficient heat dissipation, such as an adjustable fan speed control and an array of fins that increase the overall surface area of the heat sink chassis. Additionally, the device is constructed from high-grade aluminum, providing superior thermal management and durability. The ATS-50350P-C3-R0 is an ideal choice for high-performance applications, where efficient heat dissipation is required.
The specific data is subject to PDF, and the above content is for reference