ATS-50375G-C1-R0

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A thermal heat sink is a device used to reduce the temperature of an electronic or electric component that produces or dissipates a large amount of heat. Thermal heat sinks alleviate the risk of an overheated component by quickly and effectively transferring heat away from the part and into the external environment. Heat sinks traditionally rely on a combination of mass-based thermal diffusion, conduction, and convection. The ATS-50375G-C1-R0 aluminum extruded heat sink is a great example of the power and efficacy of this kind of device.

Material

The ATS-50375G-C1-R0 heat sink is made from 6063 aluminum, which is a non-anodized aluminum alloy with excellent corrosion resistance, high strength-to-weight ratio, and great thermal conductivity. This makes the ATS-50375G-C1-R0 an ideal choice for applications in damp and corrosive environments. Its low weight and excellent thermal transfer characteristics ensure that it can constantly move heat away from the part it is attached to, without fear of mechanical failure or thermal overload.

Design

The ATS-50375G-C1-R0 is a relatively small heat sink with an overall height of just 40.9 mm. It is composed of a large number of densely arranged aluminum fins with a base area of 68.94 mm². This fin shape is ideal for dissipating heat quickly as it provides a large amount of surface area for efficient heat transfer. The fins are connected to each other with a high-temperature adhesive material, allowing for a secure attachment. The design of this heat sink is such that it can dissipate as much as 50W of heat with ease.

Mounting

The ATS-50375G-C1-R0 can be mounted to an electronic component in various ways. It has four mounting holes at its base, which makes it compatible with an extensive range of mounting systems, including bolt-on, clip-on, and spring-loaded mounts. This allows for great flexibility when it comes to mounting and positioning the heat sink on a particular component.

Performance

The ATS-50375G-C1-R0 is an incredibly effective heat sink. When tested under normal conditions, it was able to dissipate up to 50W of heat over a short period of time. This enables it to keep electronic and electrical components cool during periods of high usage, thus effectively extending their lifespan. Additionally, the design of the ATS-50375G-C1-R0 ensures that it is able to dissipate heat even in colder environments, allowing it to maintain optimal operating temperatures even in challenging conditions.

Application Fields

The ATS-50375G-C1-R0 heat sink is best suited for applications in electronics, electricals, or telecommunications that require high reliability and extended component lifespan. Its lightweight and slim profile make it especially suitable for use in portable and space-saving devices, as well as for applications where heat dissipation is a priority. Furthermore, its corrosion resistance and high thermal conductivity make it an ideal choice for use in damp and corrosive environments.

Working Principle

The ATS-50375G-C1-R0 heat sink works by dissipating heat from a component or circuit by a process of thermal diffusion. This process is enabled by the conduction and convection of heat away from the part. Heat is initially absorbed by the heat sink, before being dissipated into the surrounding environment. The combination of aluminum\'s high thermal conductivity and the heat sink\'s efficient fin design allow for the effective and quick dissipation of heat.

Through its combination of high thermal conductivity, lightweight and slim design, and efficient mounting system, the ATS-50375G-C1-R0 aluminum extruded heat sink is a fantastic solution for electronic and electrical components that require reliable and efficient heat dissipation. Its corrosion resistance and optimal performance in challenging environments make it an ideal choice for a variety of applications.

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